Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
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| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
The U.S. Department of Commerce is seeking proposals to establish and operate a CHIPS Manufacturing USA institute focused on digital twins for the semiconductor industry. Digital twins are virtual models...
Discover key developments from TSMC's 2024 North America Technology Symposium, including A16 Technology, NanoFlex Innovation, N4C Technology, and more.
Discover how Ansys and TSMC are collaborating on multiphysics software for Silicon Photonics integration systems to revolutionize chip-to-chip communication.
Intel has been awarded Phase Three of the DoD's RAMP-C program, showcasing readiness in process technology and high-volume manufacturing with Intel 18A.
Intel Foundry has received and assembled the industry’s first High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography system, a next-generation lithography system developed by ASML. The ASML TWINSCAN EXE:5000...
By James E. Carroll, Editor Intel provided an update on its large-scale neuromorphic systems based on its human brain-inspired Loihi 2 processors. Neuromorphic computing refers to a type of computing...
Samsung Electronics is set to receive up to $6.4 billion in funding under the CHIPS Act, boosting their presence in Texas with new facilities and job opportunities.
Achieving scale-up and scale-out AI systems requires an advanced networking fabric. In his keynote. Intel CEO Pat Gelsinger said he expects Ultra Ethernet to meet this requirement. Intel plans to...
TSMC is to receive up to $6.6 billion in direct funding under the CHIPS and Science Act to support its investment of more than $65 billion in three greenfield leading-edge...
SK hynix plans to invest an estimated $3.87 billion to build a state-of-the-art advanced packaging fabrication and R&D facility for AI products in West Lafayette, Indiana. SK hynix is the...
Celestial AI secures $175 million in Series C funding for its Optical Compute Interconnect, promising lower latency and power consumption. Exciting advancements in optical interconnect technology!
Acacia introduces 800G DSP-based pluggable modules for metro DCI upgrades, supporting QSFP-DD and OSFP form factors compliant to OIF 800ZR.
Coherent Corp. unveils I-temp 100G ZR QSFP28 DCO transceiver for outdoor deployment in edge networks, offering expanded temperature range and low power consumption.
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