OCP targets standard for GPU management
At OCP Summit in San Jose, Microsoft announced a collaborative effort with AMD, Google, Meta, and NVIDIA to create OCP standard requirements for GPU management. Standardizing allows suppliers to seamlessly...
Semiconductors
Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
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| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
MaxLinear launches DOCSIS 4.0 cable modem and gateway chipset
MaxLinear released its DOCSIS 4.0 SoC cable modem and gateway platform, Puma 8. The new chipset builds on the success of its DOCSIS 3.0 and 3.1 predecessors (Puma 6 and...
Broadcom develops DOCSIS 4.0 AI Chipset with Comcast
Comcast and Broadcom are designing and building the new chipset based upon CableLabs’ DOCSIS 4.0 specifications and aimed at enabling the first AI-powered access network. The new chipset that embeds AI...
MaxLinear supplies G.hn chipset to Positron
Positron Access Solutions has selected the MaxLinear G.hn chipset for use in its G.hn Access Multiplexers (GAM) products. The Positron GAM solutions can deliver gigabit-class services to legacy properties over...
Mitsubishi Electric to Invest in Coherent’s new silicon carbide business
Mitsubishi Electric will invest US$500 million (approx. 75 billion yen) in Coherent Corp.'s new silicon carbide (SiC) spin-off.Mitsubishi Electric said it is aiming to expand its SiC power device business...
Intel to spin out Programmable Solutions Group under Sandra Rivera
Intel will separate its Programmable Solutions Group (PSG) operations into a standalone business effective 01-January-2024. The independent business will be headed by Sandra Rivera, who currently heads Intel’s Data Center...
Broadcom debuts 200G/lane PAM-4 DSP PHY
Broadcom announced shipping of its 5nm 200G/lane optical PAM-4 DSP PHY featuring 200G/lane serial optical interfaces, which enable 800G and 1.6T pluggable optical transceiver modules. The new Sian BCM85822 is...
Thunderbolt 5 races at 80 Gbps
ntel announced Thunderbolt 5, promising 80 Gbps of bi-directional bandwidth, and with Bandwidth Boost up to 120 Gbps for displays. Thunderbolt 5, will provide up to three times more bandwidth...
U.S. DoD funds eight Microelectronics Commons hubs
The U.S. Department of Defense awarded $238 million or the establishment of eight Microelectronics Commons (Commons) regional innovation hubs. The Microelectronics Commons, a key component of the CHIPS and Science...
Intel demos multi-chiplet package using UCIe interconnects
Intel demonstrated the first multi-chiplet package using Universal Chiplet Interconnect Express (UCIe) interconnects. Universal Chiplet Interconnect Express (UCIe) is an open industry standard for a die-to-die interconnect and serial bus...
indie Semi acquires EXALOS for optical
indie Semiconductor has acquired privately held EXALOS AG, a Swiss photonics company, specializing in the design of high-performance optical semiconductors. indie paid approximately $45 million to EXALOS equity holders comprised...
SiTime delivers MEMS-based ultra-stable clock for datacenter and network infrastructure
SiTime introduced a MEMS-based, oven-controlled oscillator (OCXO) that delivers an ultra-stable clock to datacenter and network infrastructure equipment In order to maintain optimal network performance and reliability, precision timing plays...
AMD releases Siena CPUs for intelligent edge, data centers
AMD announced the availability of its EPYC 8004 Series processors featuring the "Zen 4c" core, which is optimized for energy efficiency and performance in space-constrained environments from the intelligent edge...
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