Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
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| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
At SC23 in Denver, Intel is showcased AI-accelerated high performance computing (HPC) data center technologies. In partnership with Argonne National Laboratory, Intel shared progress on the Aurora generative AI (genAI)...
Ericsson introduced its most advanced RAN Compute products to date, designed for the network demands of 5G Advanced and enhanced artificial intelligence (AI) algorithms and powered by latest generation of...
Adtran is integrating the Intel NetSec Accelerator Reference Design with its Ensemble Cloudlet solution to enhance edge cloud deployments with advanced security, faster data processing and improved networking performance. The...
NVIDIA launched its H200 Tensor Core GPU based on its Hopper architecture and designed with advanced memory to handle massive amounts of data for generative AI and high performance computing...
"Overall, IDC expects the total semiconductor industry to decline by 12% in 2023, which is an improvement from our September outlook. Revenues will continue to recover gradually and accelerate in...
JUPITER, the exascale supercomputer being built in Germany, will be powered by NVIDIA Grace Hopper architecture, delivering extreme-scale computing power for AI and simulation workloads. It marks the debut of...
RISC-V gains momentum RISC-V, the open-source instruction set architecture (ISA) based on established reduced instruction set computer (RISC) principles, is gaining traction beyond embedded systems to include aerospace, AI/ML, Android...
Ventana Micro Systems, a start-up based in Cupertino, California, unveiled the second generation of its Veyron family of RISC-V processors. The new Veyron V2, which claims to be the highest...
Texas Instruments commenced construction on its second 300-mm wafer fab in Lehi, Utah. LFAB2 will complement TI’s existing 300-mm wafer fabs, which include LFAB1 (Lehi, Utah), DMOS6 (Dallas), and RFAB1...
SiTime agreed to acquire the clock products of Aura Semiconductor, a multinational fabless semiconductor company based in Bangalore. TUndet the deal, SiTime will also license all of its clock IP....
Rambus announced that its HBM3 Memory Controller IP is now capable of up to 9.6 Gbps performance. This represents a 50% increase over the HBM3 Gen1 data rate of 6.4...
Broadcom released the next generation of its StrataDNX family of single chip routers for carriers and cloud operators. Qumran3D boasts 25.6 Terabits per second of routing in a fixed form...
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