Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
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| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
AMD released the 4th Gen EPYC processors, code-named Genoa, boasting up to 96 cores in a single processor and aimed at mission-critical workloads across cloud, enterprise and high performance computing.The...
Cisco announced plans to launch a center for the design of next generation semiconductor devices in Spain. The announcement was made by Chuck Robbins, Chair and Chief Executive Officer of...
Tektronix announced a collaboration with BRIDG, a not-for-profit, public-private partnership specializing in advanced system integration and integrated circuit packaging. This collaboration will expand advanced semiconductor package testing capabilities in the...
Kyocera has developed a new thin-film process technology for making silicon (Si) substrates for gallium nitride (GaN)-based micro-light sources, including short-cavity lasers and micro-LEDs.GaN-based light-source devices, both micro-LED and laser,...
More that 60 companies have come together to form a new Semiconductor Climate Consortium (SCC) to accelerate the ecosystem’s reduction of greenhouse gas emissions.The consortium’s members are committed to working...
Marvell's first 3nm silicon is now in fabrication with Taiwan Semiconductor Manufacturing Company (TSMC) on its 3nm shuttle. Marvell said this advancement will enable it to develop some of the...
Google Cloud introduced its Compute Engine C3 VMs powered by the 4th Gen Intel Xeon Scalable processor and Google’s custom Intel Infrastructure Processing Unit (IPU).C3 machine instances use offload hardware...
The U.S. Department of Commerce’s Bureau of Industry and Security (BIS) announced a set of updates to its export controls aimed at restricting the People's Republic of China’s ability to...
AIROHA, a subsidiary of Taiwan-based MediaTek,confirmed that is XGS-PON chips are now being used in customer premise equipment (CPE) by a U.S. broadband provider.AIROHA says its XGS-PON ICs enable symmetric...
At its annual Samsung Foundry Forum event in San Jose, California, Samsung Electronics outlined its goals to drive process nodes to 1.4nm in 2027. Samsung, which currently has 3nm process technology...
Qualcomm confirmed that its upcoming X100 5G RAN Accelerator Card and QRU100 5G RAN platform are now sampling with first customers. Commercial deployments from OEMs are now expected in 2023.Qualcomm...
Wolfspeed unveiled plans to build a new, state-of-the-art, multi-billion-dollar materials manufacturing facility in Chatham County, North Carolina. The new facility is targeted to generate a more than 10 fold increase from...
Intel held a groundbreaking ceremony attended by President Biden to mark the beginning of construction on two advanced chipmaking facilities in Ohio. Intel also announced the first phase of funding for...
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