Samsung Electronics began sampling a 512GB DDR5 module based on High-K Metal Gate (HKMG) process technology. The memory module delivers more than twice the performance of DDR4 at up to 7,200...
Intel CEO Pat Gelsinger outlined the company’s path forward to an integrated device manufacturing model. The IDM2 strategy has 3 elements:Building Intel’s global, internal factory network for at-scale manufacturing. Intel...
The U.S. Defense Advanced Research Projects Agency (DARPA) is launching an industry collaboration with Intel to expand access to domestic manufacturing capabilities for custom chips for defense systems. DARPA's Structured Array...
Xilinx expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. The company's Artix and Zynq UltraScale+ devices are now available in TSMC’s state-of-the-art InFO...
Renesas Electronics Corporation was struck by a fire in the N3 Building (300mm line) of its Naka Factory (located in Hitachinaka, Ibaraki Prefecture) on March 19, 2021 at 2:47am.The fire...
Credo introduced its Black Hawk (CRT55321), a PAM4 retimer and gearbox for providing guaranteed, end-to-end signal integrity in backplane, front panel and copper applications. The new device, which leverages the company’s...
Qualcomm completed its previously announced acquisition of NUVIA for $1.4 billion before working capital and other adjustments.“The world-class NUVIA team enhances our CPU roadmap, extending Qualcomm’s leading technology position with...
AMD unveiled its EPYC 7003 Series CPUs, claiming the highest performance benchmark for a server processor with up to 19% more instructions per clock. The AMD EPYC 7003 Series Processors have...
Lattice Semiconductor's Diamond and FPGA design tools for its highly reliable, low-power, small form factor FPGAs are now included in the DARPA Toolbox initiative. The DARPA Toolbox initiative is a new,...
Apple announced plans to create a European Silicon Design Center in Munich, adding hundreds of new employees and a new state-of-the-art facility focused on connectivity and wireless technologies. The company...
Marvell will join the Evenstar program and work with Facebook Connectivity to provide a 4G/5G OpenRAN Distributed Unit (DU) design for Evenstar based on its OCTEON Fusion baseband processors and...
Fujitsu has selected Marvell’s baseband processor silicon to power its new 5G New Radio (NR) base stations.Specifically, Fujitsu will adopt Marvell’s OCTEON Fusion baseband processors for their 5G base station...
Semtech is now sampling its new Tri-Edge CDR to emerging 50Gbps PAM4 5G front haul deployments. The new solution (GN2255), which is based on the company's existing Tri-Edge CDR platform qualified...
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