Semiconductors

Intel announced plans to $3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Foveros, its 3D packaging technology.Foveros advanced 3D packaging technology...

Alphawave IP, a start-up offering DSP-based silicon IP building blocks, has filed registration statements for a planned listing on the London Stock Exchange.Recently, Alphawave announced the successful silicon bring up...

Renesas Electronics and SiFive agreed to jointly develop next-generation, high-end RISC-V solutions for automotive applications. The partnership will also include SiFive licensing the use of their RISC-V core IP portfolio...

Marvell Technology completed its previously announced acquisition of Inphi Corporation.  The combination creates a U.S. semiconductor powerhouse positioned for end-to-end technology leadership in data infrastructure.“I am excited to welcome the...

Cerebras Systems, a start-up developing a Wafer Scale Engine (WSE) chip that contains 1.2 trillion transistors, covers more than 46,225 square millimeters of silicon and contains 400,000 AI optimized compute...

NVIDIA outlined a roadmap for the next two generations of its BlueField data processing unit (DPU) chips.The current generation, BlueField-2, is now shipping and features dual 100Gb/s Ethernet or InfiniBand...

Achronix announced sampling of its 7nm Speedster 7t AC7t1500 FPGAs to customers ahead of schedule. The Speedster7t family targets high bandwidth workloads in AI/ML, 5G infrastructure, networking, computational storage, and test/measurement.Achronix...

Cadence Design Systems has optimized its chip design software for Samsung Foundry’s advanced-process technologies down to 4nm. The companies said Cadence digital 20.1 flow provides capabilities that are well-suited for Samsung...

Intel launched its 3rd Gen Xeon Scalable processors (code-named “Ice Lake”) featuring an average 46% improvement on popular data center workloads over the previous generation.The new Xeon processors, which are...

OpenFive, a SiFive Business Unit, introduced a Die-to-Die (D2D) PHY that complements the company’s existing D2D Controller to offer complete D2D interface solutions for various packages including substrates and interposers.OpenFive...

Arm introduced its v9 architecture which is expected to become the processing basis for hundreds of billions of devices in the years ahead.Armv9, which is the first new Arm architecture...

Analog Devices announced an ASIC-based radio platform for O-RAN compliant 5G radio units. The solution includes all the core functionality needed in an O-RAN compliant 5G radio unit, including a...

Samsung Electronics and Marvell have  jointly developed a new System-on-a-Chip (SoC) to power Samsung’s Massive MIMO and other advanced radios.The new SoC supports 5G and 4G networks simultaneously, and it...