Celestica announced that its DS6000-series 1.6TbE data center switches are now available to order, marking the transition from development to commercial deployment for next-generation AI networking platforms. The systems target large-scale generative AI and machine learning clusters, where ultra-high bandwidth and low-latency fabrics are required to support distributed training and inference workloads.
The DS6000 portfolio includes two form factors: the air-cooled DS6000 (3RU) for standard 19-inch racks and the hybrid-cooled DS6001 (2OU) designed for 21-inch Open Compute Project (OCP) ORv3 environments. Both systems are built on Broadcom’s Tomahawk 6 switching silicon, delivering up to 102.4 Tbps of non-blocking throughput. Each switch supports 64 ports of 1.6TbE (OSFP224), enabling high-density interconnects optimized for AI back-end networks. The platform supports both copper and optical interconnects and aligns with emerging standards from the Ultra Ethernet Consortium and Open Compute Project, including Ethernet Scale-up Network (ESUN) specifications.
Celestica positions the DS6000 series as an open networking solution with support for SONiC, enabling hyperscalers and cloud providers to customize their network operating environments. The company will showcase the DS6001 at the OCP Regional Summit in Barcelona, where it plans to highlight 1.6TbE architectures for scaling AI “factory” deployments.
- DS6000-series switches now available for order, targeting AI-scale data center fabrics
- Based on Broadcom Tomahawk 6 with 102.4 Tbps switching capacity
- 64 ports of 1.6TbE (OSFP224) per system for high bandwidth density
- Two configurations: 3RU air-cooled (19-inch racks) and 2OU hybrid-cooled (OCP ORv3)
- Supports both copper and optical interconnects
- Aligns with UEC and OCP ESUN standards for AI networking
- SONiC support enables open, programmable network environments
“The move to 1.6TbE networking represents a monumental leap in data center evolution, and our engineering teams have worked tirelessly to ensure the DS6000-series is the definitive choice for the AI era,” said Gavin Cato, SVP & GM, AI Platform Engineering at Celestica.
🌐 Analysis: The availability of Tomahawk 6–based systems signals that 102.4 Tbps switching is entering early production across the hyperscale supply chain, aligning with the industry’s transition from 800G to 1.6T interconnects. Celestica’s focus on SONiC and OCP-aligned designs reflects continued momentum toward disaggregated, open networking stacks, particularly as competitors such as Arista Networks, Cisco, and NVIDIA expand Ethernet-based AI fabrics alongside proprietary interconnect approaches.
