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Home » ECOC 2018: DSFP form factor doubles data rate and density of SFP

ECOC 2018: DSFP form factor doubles data rate and density of SFP

September 25, 2018
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A rev 1.0 hardware specification has been released for new DSFP (Dual Small Form-Factor Pluggable) modules — doubling the data rate and port density of SFP modules in the same footprint.

Whereas SFP has a single electrical lane pair operating at bit and data rates up to 28 Gbps using NRZ and 56 Gbps using PAM4, the new DSFP has two electrical lane pairs, each operating at bit rates up to 26 Gbps using NRZ and 56 Gbps using PAM4, supporting aggregate date rates up to 56 Gbps and 112 Gbps, respectively. DSFP will potentially scale to a per lane bit rate of 112 Gbps using PAM4, supporting aggregate data rate up to 224 Gbps. SFP modules can be plugged into DSFP ports for backwards compatibility.

The spec was developed by the DSFP MSA (Multi-Source Agreement) Group, whose founding members are Amphenol, Finisar, Huawei, Lumentum, Molex, NEC, TE Connectivity, and Yamaichi.

The DSFP Hardware Specification Rev. 1.0 includes complete electrical, mechanical and thermal specifications for module and host card, including connector, cage, power, and hardware I/O. Also included are operating parameters, data rates, protocols, and supported applications.

Work is now underway on the DSFP MIS (Management Interface Specification), which is an abridged version of the CMIS (Common MIS) being developed by the QSFP-DD, OSFP and COBO Advisors Group.

“We are very excited about the introduction of a highly competitive new form factor by the DSFP MSA, which will double interface bandwidth and port density while maintaining compatibility with the existing SFP family of optics,” said Zhoujian Li, President of Research and Development, Wireless Networks, Huawei. “The DSFP form factor is low cost, has excellent high-speed signal integrity, reduces PCB area and is easy to design and manufacture.  It is a great platform that enables 5G deployment and evolution, while fully protecting our customers’ investment.”

“Publication of the DSFP Hardware Specification is part of an industry trend of quickly developing solutions optimized for specific applications. Stringent cost, power and size constraints in demanding market segments, like Mobile infrastructure, leads to solutions focused strictly on required functionality,” commented Chris Cole, Chair of the DSFP MSA Group, and Vice President of Advanced Development, Finisar.

http://www.dsfpmsa.org

Tags: Blueprint columnsDSFPECOCStandards
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