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Home » ECOC22: Broadcom’s Silicon Photonics Chiplets in Package

ECOC22: Broadcom’s Silicon Photonics Chiplets in Package

September 18, 2022
in All, Video
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What’s Next at #ECOC22 for Broadcom? 

Broadcom’s Silicon Photonics Chiplet in Package (SCIP). 

Rebecca Schaevitz, Product Line Manager & Principal Engineer at Broadcom, provides an introduction. 

Learn more about the Consortium for Onboard Optics and why your company should join:

https://www.onboardoptics.org

Tags: #ECOC22Blueprint columnsBroadcomCOBOSilicon Photonics
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