GlobalFoundries introduced its SCALE optical module platform to accelerate deployment of co-packaged optics (CPO) in AI data centers, positioning the solution as the first platform aligned with the Optical Compute Interconnect MSA(OCI MSA). The announcement highlights a growing industry push to replace copper interconnects with optical links in scale-up AI architectures, where bandwidth density and power efficiency have become limiting factors.
The SCALE (Silicon photonics Co-packaged Advanced Light Engine) platform builds on GlobalFoundries’ silicon photonics technology and exceeds OCI MSA optical interconnect specifications. The solution supports both coarse and dense wavelength-division multiplexing (CWDM and DWDM), enabling bi-directional transmission over a single fiber. GF confirmed demonstrations of 8λ and 16λ bi-directional DWDM, marking a step toward higher bandwidth density and scalable optical interconnect fabrics for next-generation AI clusters.
GF’s platform integrates a portfolio of photonic devices, including 50Gbps and 100Gbps micro-ring modulators, coupled resonators, and photodiodes, alongside advanced packaging features such as through-silicon vias and sub-45μm copper pad pitches for 2.5D and 3D integration. The architecture supports detachable fiber interfaces with flat insertion loss across the CWDM spectrum, enabling scaling from 4λ to 8λ and beyond while maintaining serviceability and known-good-die testing—key requirements for hyperscale deployment.
- First platform positioned as OCI MSA-capable for CPO architectures
- Demonstrated 8λ and 16λ bi-directional DWDM on silicon photonics platform
- Supports CWDM and DWDM for higher bandwidth density per fiber
- Integrated photonics: 50Gbps/100Gbps micro-ring modulators and photodiodes
- Advanced packaging: TSVs and sub-45μm pad pitch for 2.5D/3D integration
- Detachable fiber design enables serviceability and scalable wavelength expansion
- Targets AI scale-up interconnects where copper reaches power and density limits
“With over a decade of innovation and manufacturing expertise in silicon photonics technology at our disposal, GF stands ready to unlock the future of high-bandwidth, energy-efficient connectivity with our SCALE solution for co-packaged optics,” said Mike Hogan, chief business officer at GF.
🌐 Analysis: GlobalFoundries is aligning directly with the OCI ecosystem, which is emerging alongside competing scale-up interconnect efforts such as Ultra Ethernet Consortium and proprietary GPU cluster fabrics. The emphasis on DWDM scaling and detachable fiber approaches reflects broader industry attempts—also seen from vendors like Broadcom and NVIDIA—to make co-packaged optics manufacturable and serviceable at hyperscale.
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