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Home » Huawei to Build Joint Innovation Centre with Bell Canada

Huawei to Build Joint Innovation Centre with Bell Canada

January 16, 2011
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Huawei and Bell Canada signed a Memorandum of Understanding (MOU) to create and maintain a Joint Innovation Centre (JIC) in Canada. Huawei and Bell will collaborate on developing and enhancing broadband wireless solutions, core network products and value-added service offerings.

“Huawei played a key role in the introduction of Bell’s world-leading HSPA+ network, and we’re confident this Joint Innovation Centre will create further breakthrough products and services that keep both companies at the forefront of mobile communications technology,” said Stephen Howe, Bell’s Executive Vice President and Chief Technology Officer. “Bell has invested billions of dollars in rolling out the latest mobile innovations to rural communities, small towns and urban centres alike across Canada. We are very pleased that our partner Huawei has also committed to Canadian wireless advancement, with significant investments in Canadian talent, this new Joint Innovation Centre and the Huawei R&D Centre in Ottawa.”http://www.huawei.com

Tags: Blueprint columnsCanadaHuaweiMobilePacket SystemsRadisys
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