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Home » Intel Expands Defense Chip Production with $3 Billion in CHIPS Act Funding

Intel Expands Defense Chip Production with $3 Billion in CHIPS Act Funding

September 16, 2024
in Semiconductors
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Intel secured up to $3 billion in direct funding under the CHIPS and Science Act to support the Secure Enclave program, which aims to enhance trusted manufacturing of advanced semiconductors for U.S. government use. This new funding is part of the Biden-Harris Administration’s efforts to strengthen domestic chip production and security. Intel, which designs and manufactures leading-edge logic chips, will collaborate with the Department of Defense (DoD) to bolster the resilience of U.S. technological systems through secure, high-performance solutions.

The Secure Enclave program builds on previous collaborations between Intel and the DoD, such as the Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) and State-of-the-Art Heterogeneous Integration Prototype (SHIP) projects. These initiatives have focused on securing the U.S. chip supply chain and advancing domestic microelectronics capabilities. Separate from this award, Intel had already secured funding earlier this year to modernize its commercial semiconductor fabrication facilities, further expanding its role in U.S. technological infrastructure.

Intel’s collaboration with the DoD includes delivering multi-chip package prototypes through the SHIP program and commercial foundry services for the RAMP-C initiative. The company is working with defense contractors such as Boeing and Northrop Grumman to develop and manufacture custom integrated circuits for critical defense systems. Intel’s 18A process technology, slated for production in 2025, is central to these efforts, ensuring secure, domestic production of advanced microelectronics.

• $3 billion awarded to Intel under the CHIPS and Science Act

• Intel collaborates with DoD through RAMP-C and SHIP programs

• Funding supports secure domestic manufacturing of advanced semiconductors

• Intel’s 18A technology expected to enter production in 2025

• Intel delivers multi-chip package prototypes and custom circuits for defense contractors

“Intel is proud of our ongoing collaboration with the U.S. Department of Defense to help strengthen America’s defense and national security systems,” said Chris George, president and general manager of Intel Federal.

Tags: CHIPs ActIntel
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Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

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