• Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Tuesday, June 2, 2026
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Intel re-hires Sunil Shenoy to lead Design Engineering Group

Intel re-hires Sunil Shenoy to lead Design Engineering Group

January 27, 2021
in All
A A

Intel announced the appointment of Sunil Shenoy as senior vice president and general manager of the Design Engineering Group.

Shenoy, a 33-year Intel veteran who departed in 2014, will lead design, development, validation and manufacturing of intellectual properties and system-on-chips (SOC) for client and data center applications. 

Most recently, Shenoy was senior vice president and general manager of RISC-V at SiFive, an Intel Capital portfolio company working to commercialize the RISC-V open architecture. At SiFive, Shenoy helped build the engineering team. In his prior years at Intel, Shenoy was corporate vice president in charge of Intel’s Platform Engineering Group, responsible for microprocessor and SoC design across Intel’s product groups. He also led Intel’s Visual and Parallel Computing Group and server and PC silicon development R&D and engineering, among other responsibilities.

Tags: Blueprint columnsIntelPeople
ShareTweetShareSummarizeSummarize
Previous Post

Ericsson’s 5G RAN slicing allocates resources with 1ms scheduling

Next Post

Deutsche Telekom tests Samsung 5G SA in Czech Republic

Staff

Staff

Related Posts

Financials

Intel Appoints Client Computing Chief and CTO

May 4, 2026
All

Intel Q1 2026: AI Drives 22% Data Center Growth, Foundry Revenue Up

April 23, 2026
Semiconductors

Intel, Google Expand AI Infrastructure Pact Around Xeon and Custom IPUs

April 9, 2026
AI Infrastructure

SambaNova and Intel Advance Heterogeneous Architecture for Agentic AI Inference

April 8, 2026
Semiconductors

Intel Foundry Demos 19 μm GaN Chiplet with Integrated Logic 

April 8, 2026
All

Intel Confirms Role in Terafab Initiative

April 7, 2026
Next Post

Deutsche Telekom tests Samsung 5G SA in Czech Republic

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version