Deutsche Telekom’s Dr. Mudesir appointed chair of O-RAN Alliance
Dr. Abdurazak Mudesir, Group CTO of Deutsche Telekom, has been elected as Chair of the Board of O-RAN Alliance. Under ...
Armada secures $40 Million for its AI Edge
Armada, an edge computing start-up based in San Francisco, has announced a $40 million funding round led by M12, Microsoft's ...
NTT DATA lands major contract for FBI’s Mission Critical Services
NTT DATA, a leading provider of digital business and IT services, has been chosen as a prime contractor by the ...
Ekinops Reports Q2 and H1 2024 Financial Results
In Q2 2024, Ekinops, a leading provider of telecommunications solutions, reported consolidated revenue of €29.2 million, reflecting a 25% decrease ...
Dell’Oro: Mobile core network market continues decline
The Mobile Core Network (MCN) market 5-year cumulative revenue forecast is expected to decline 10 percent (2024-2028), according to a ...
CHIPS R&D Office offers $1.6 Billion for Advanced Packaging
The CHIPS Research and Development Office has unveiled plans for a major funding initiative aimed at revolutionizing semiconductor advanced packaging ...
SEMI: Global semiconductor equipment sales to hit record $109B in 2024
Global sales of semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecasted to reach an unprecedented $109 billion in ...
AMD to acquire Silo AI for $665 Million, expanding AI capabilities
AMD agreed to acquire Silo AI, Europe’s largest private AI lab, for approximately $665 million in cash. This acquisition is ...
Tech Update: IOWN Mid-2024 Progress Report
The Innovative Optical and Wireless Network Forum (IOWN), which was founded in 2020 by NTT to accelerate the transition to ...
Sparkle activates PoP at Rome’s Largest Data Centre Campus
Sparkle, Italy’s premier international service provider, and Aruba S.p.A, the country’s leading provider of cloud and data services, have announced ...
Applied Materials unveils Advanced Chip Wiring and Stacking
Applied Materials introduced groundbreaking materials engineering innovations designed to enhance the performance-per-watt of computer systems. These innovations enable copper wiring ...
Samsung’s 2nm Process and Advanced Packaging to power AI accelerators
Samsung Electronics has announced a significant partnership with Preferred Networks, a leading Japanese AI company, to provide cutting-edge semiconductor solutions. ...
GIX activates NYC-NJ dark fiber route via PATH tunnel
Global InterXchange (GIX), in partnership with the Port Authority of NY and NJ, activated a new dark fiber route linking ...
A private dossier for networking and telecoms