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Home » Qualcomm Intros Ultrasonic Fingerprint Authentication

Qualcomm Intros Ultrasonic Fingerprint Authentication

March 5, 2015
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Qualcomm is introducing 3D fingerprint authentication that uses ultrasonic technology to directly penetrate the outer layers of skin, detecting three-dimensional details and unique fingerprint characteristics, including fingerprint ridges and sweat pores. Compared to existing capacitive touch-based fingerprint technologies the company said it is able to achieve government-grade biometric solutions because the scan will be extremely difficult to spoof.

QTI’s ultrasonic fingerprint technology has a number of distinct advantages over capacitive touch-based fingerprint technologies, including the ability to scan through a smartphone cover that is made of glass, aluminum, stainless steel, sapphire and plastics.

“Mobile devices increasingly store our most valuable and sensitive information, while passwords alone do not provide the protection consumers deserve,” said Raj Talluri, senior vice president, product management, QTI. “Snapdragon Sense ID 3D Fingerprint Technology’s unique use of ultrasonic technology revolutionizes biometrics from 2D to 3D, allowing for greater accuracy, privacy and stronger authentication. We are very proud to bring the mobile industry’s first ultrasonic-based biometric authentication technology to mobile device manufacturers and their customers, who will benefit from the improved and differentiated user experience.”

http://www.qualcomm.com

Tags: Blueprint columnsQualcomm
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