• Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Wednesday, June 3, 2026
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Qualcomm targets 5G RAN platforms

Qualcomm targets 5G RAN platforms

October 21, 2020
in All
A A

Qualcomm introduced a new family of chipsets targetting 5G infrastructure, ranging from macro base stations with massive MIMO to micro base stations with compact designs. There are new three new 5G RAN platform offerings: Qualcomm Radio Unit Platform, Qualcomm Distributed Unit Platform, and Qualcomm Distributed Radio Unit Platform. 

Qualcomm said it took a ground up approach is designing these chipsets to support leading mobile operators in the deployment of a new generation of converged, open and virtualized RAN (vRAN) networks. 

“Our 5G expertise and global technology leadership uniquely positions Qualcomm Technologies to provide a comprehensive horizontal infrastructure platform to enable the deployment of innovative, high-performance, virtualized, and modular 5G networks at scale,” said Cristiano Amon, President, Qualcomm Incorporated. “We are working closely with mobile operators, network equipment vendors, standards bodies and other key stakeholders to make the deployments of these networks a reality.”

Key highlights of the Qualcomm 5G RAN Platforms portfolio:

  • From Macro to Small Cells: The solutions offer scalable support for a wide range of infrastructure categories ranging from macro base stations with massive MIMO to small cells.
  • High performance Modem-RF: Designed for superior radio performance including high-power, high capacity operation, the Qualcomm 5G RAN Platforms feature a comprehensive 5G Modem-RF System including baseband, transceiver, front-end and antenna panels.
  • Enabling high performance virtualized products with integrated hardware acceleration: Flexible vRAN architecture with hardware accelerators for modem and fronthaul processing designed to enable high throughput low latency network processing for superior power-efficiency and compact equipment designs.
  • Flexible, scalable, interoperable interfaces: Support for all key 5G functional split options between Distributed Unit (DU) and Radio Unit (RU), to allow for the disaggregation of the RAN into standards-based and interoperable modular components.
  • Integrated Sub-6 and mmWave solution: Natively integrated Sub-6 GHz and mmWave concurrent baseband support in the Distributed Unit along with global support for 5G sub-6 GHz, mmWave and 4G bands in the Radio Unit.
Tags: Blueprint columnsQualcomm
ShareTweetShareSummarizeSummarize
Previous Post

Verizon, Ericsson and Qualcomm hit 5.06 Gbps

Next Post

NETGEAR’s Q3 sales leap 42% to $378 million

Staff

Staff

Related Posts

Financials

Qualcomm Reports $10.6B in Q2 FY26 Revenue, AI and Data Center Expansion

April 29, 2026
Automotive Networking

Wayve Adds AMD, Arm, and Qualcomm in $60M Series D 

April 15, 2026
5G / 6G / Wi-Fi

Qualcomm Launches Agentic RAN Management Service 

March 4, 2026
All

Chiplet Summit 2026: Qualcomm on the New Foundation of Chiplets

February 18, 2026
All

Qualcomm Completes Alphawave Semi Deal, Expands Data Center Ambitions

February 4, 2026
Optical

Qualcomm Completes Alphawave Semi Acquisition, Accelerates Data Center Push

December 18, 2025
Next Post

NETGEAR's Q3 sales leap 42% to $378 million

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version