Ranovus has delivered a 6.4Tbps co-packaged optics solution for MediaTek’s next generation ASIC design platform.
Ranovus says its Odin CPO 3.0 reduces power consumption, footprint, and cost of the system by 50% compared to existing solutions. The solution enables a 6.4Tbps high-radix optical interconnect for AI/ML SoC and Ethernet applications.
Ranovus’ monolithic Electro-Photonic Integrated Circuit (EPIC) is a single chip that includes 100Gbps TIAs, Drivers, Silicon Photonics Modulaters and Photo detectors. Odin CPO 3.0 includes optical features that enables passive fiber and laser die attach on the EPIC die at scale. Ranovus Odin IP cores are available for development of a new category of Application Specific Optical Engines (ASOE) for high capacity AI/ML workloads.
“The emergence of Generative AI has not only resulted in significant demand for higher memory bandwidth and capacity, but also demand for higher I/O density and speeds.” said Jerry Yu, Senior Vice President at MediaTek. “Integration of electrical and optical I/O is the latest technology that allows MediaTek to deliver the most flexible leading edge data center ASIC solutions.”
“Working together with MediaTek to realize this next-genera`on CPO plaaorm has helped usher in a new era for high-density op`cal interconnect in the AI/ML and Ethernet ecosystem,” said Hojjat Salemi, Chief Business Development Officer at Ranovus. “This plaaorm will play a cri`cal role in accelera`ng data movement in scale up/scale out AI/ML SoCs and Ethernet.”
