• Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
  • buzzwords
  • Archives
  • Milestones
  • On This Day
  • Video Search
Converge Digest
Friday, July 17, 2026
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
  • buzzwords
  • Archives
  • Milestones
  • On This Day
  • Video Search
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Samsung Electro-Mechanics partners with AMD for substrates

Samsung Electro-Mechanics partners with AMD for substrates

July 23, 2024
in All, Semiconductors
A A

Samsung Electro-Mechanics (SEMCO) has announced a collaboration with AMD to supply high-performance substrates designed for hyperscale data center compute applications. These advanced substrates are produced at SEMCO’s technology hub in Busan and a newly constructed state-of-the-art factory in Vietnam. SEMCO has invested 1.9 trillion KRW (approximately $1.6 billion USD) in the new FCBGA factory, highlighting its dedication to enhancing substrate technology and manufacturing capabilities to meet the highest industry standards and future technological needs.

The partnership with AMD aims to address the challenges of integrating multiple semiconductor chips (chiplets) on a single large substrate. These substrates, crucial for CPU and GPU applications, provide larger surface areas and higher layer counts necessary for dense interconnections in advanced data centers. Compared to standard computer substrates, those used in data centers are ten times larger and feature three times more layers, ensuring efficient power delivery and signal integrity. SEMCO’s innovative manufacturing processes minimize warpage, ensuring high yields during chip mounting. The FCBGA factory is equipped with real-time data collection and modeling capabilities, allowing SEMCO to develop predictive manufacturing models that ensure the integrity of signal, power, and mechanical components, positioning SEMCO as a leader in next-generation data center substrates.

Key Points:

  • Collaboration with AMD focuses on hyperscale data center compute applications.
  • Substrates are produced in Busan, South Korea, and a new factory in Vietnam.
  • SEMCO invested 1.9 trillion KRW (approximately $1.6 billion USD) in the FCBGA factory.
  • Substrates support CPU/GPU applications with larger surface areas and higher layer counts.
  • Data center substrates are ten times larger and have three times more layers than standard substrates.
  • Advanced manufacturing processes ensure efficient power delivery and signal integrity.
  • The new factory features real-time data collection and predictive modeling capabilities.
  • SEMCO leads in producing substrates with passive and active components for next-gen data centers.
Tags: AMDKoreaSamsung
ShareTweetShareSummarizeSummarize
Previous Post

NTT and Okayama University show gigahertz ultrasonic circuit

Next Post

Network configuration error blamed for AT&T wireless outage

Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

Related Posts

Screenshot
Corporate Strategies

SK Hynix Raises $26.5 Billion as AI Memory Demand Drives U.S. Listing

July 10, 2026
AI Infrastructure

KT Targets 1 GW of AI Data Centers and 90 Tbps of Subsea Capacity

July 6, 2026
5G / 6G / Wi-Fi

Samsung AI RAN Optimizer Boosts KDDI 5G Throughput by Up to 52%

July 6, 2026
AI Infrastructure

South Korea Unveils National AI Infrastructure Strategy 

June 29, 2026
All

Samsung’s UFS 5.0 Doubles Storage Performance for AI Smartphones

June 26, 2026
All

AMD Acquires MEXT to Tackle Memory Bottlenecks

June 15, 2026
Next Post

Verizon Maintains Course in Q2, Reports Significant Reduction in Capital Spending

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Corporate Strategies
  • CPO
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Hot Start-ups
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Optical I/O
  • Pluggable Optics
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Silicon Photonics
  • Space Networking & Orbital Data Centers
  • Subsea
  • Sustainability
  • Video
  • Webinars
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
  • buzzwords
  • Archives
  • Milestones
  • On This Day
  • Video Search

© 2026 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
  • buzzwords
  • Archives
  • Milestones
  • On This Day
  • Video Search

© 2026 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version