In Focus: Samsung

 Samsung Electronics and IBM announced a collaboration to provide enterprises with new solutions for mobile edge computing and end-to-end private ...

KDDI, in collaboration with Samsung, demonstrated a 5G end-to-end (E2E) network slicing demonstration with a RAN Intelligent Controller (RIC) in ...

Samsung Electronics America has won a contract valued at approximately US$6.6 billion (7.9 trillion won) to supply network infrastructure to ...

Samsung Electronics announced that its second production line in Pyeongtaek, Korea, has commenced mass production of the industry's first 16-gigabit ...

Samsung Electronics announced the immediate availability of its 3D IC packaging technology, eXtended-Cube (X-Cube). "Samsung's new 3D integration technology ensures ...

Samsung published a whitepaper outlining its vision for 6G, including technical and societal megatrends, new services, requirements, candidate technologies and ...

Samsung Electronics Co. introduced a Secure Element (SE) chip and enhanced security software for mobile devices that offers protection for ...

Samsung Electronics will boost foundry capacity at the company's new production line in Pyeongtaek, Korea. The new foundry line will ...

SK Telecom, together with Samsung Electronics and ID Quantique, demonstrated the first 5G smartphone equipped with a quantum random number ...

Samsung announced a solid state drive with an E1.S form factor and full PCIe Gen 4 support. The new drive, ...

Samsung Electronics Co. will use the Xilinx Versal adaptive compute acceleration platform (ACAP) for worldwide 5G commercial deployments. Xilinx Versal ...

Samsung Electronics achieved speeds of 8.5 Gbps across its 5G mmWave Access Unit with MU-MIMO (Multi-User, Multiple-Input, Multiple-Output) technology. Using ...

Samsung Electronics has shipped one million of the industry's first 10nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based ...