Ansys and TSMC have expanded their partnership to deliver certified multiphysics solutions for the latest semiconductor process technologies, including TSMC’s A16 and N3C nodes. The collaboration strengthens support for 3D-IC integration, AI-assisted photonic and RF design workflows, and advanced chip signoff methodologies tailored for high-performance computing (HPC), AI, and next-generation communications.
Key Ansys tools including RedHawk-SC™, RedHawk-SC Electrothermal™, and Totem™ are now certified for the A16 process featuring TSMC’s backside power delivery architecture. For electromagnetic (EM) analysis, Ansys introduced the HFSS-IC Pro platform—certified for TSMC’s 5nm and 3nm nodes—to meet the increasing complexity of SoC and RFIC designs. The companies also co-developed AI-driven design optimization flows for photonic ICs and RF migration, integrating Ansys, Synopsys, and TSMC technologies for seamless analog and RF porting across silicon nodes.
This collaboration also supports TSMC’s Compact Universal Photonic Engine (COUPE) and introduces a shared multiphysics signoff platform combining Ansys and Synopsys tools for thermal, EM/IR, extraction, and timing convergence—accelerating 3D-IC design timelines while ensuring system-level reliability.
- Ansys RedHawk-SC, Totem, and Electrothermal certified for TSMC’s A16 and N3C processes.
- HFSS-IC Pro certified for EM analysis on TSMC’s 5nm and 3nm nodes.
- AI-powered flows support RF IC migration and photonic design using Ansys optiSLang and Lumerical.
- Integrated multiphysics signoff platform combines Ansys and Synopsys for 3D-IC power, thermal, and EM analysis.
- Designed to accelerate convergence for AI, HPC, automotive, and mobile applications.
“As chip sizes shrink and energy efficiency demands grow, Ansys continues to advance its multiphysics solutions across electromagnetics, thermal, and structural domains,” said John Lee, VP and GM of the semiconductor, electronics, and optics business unit at Ansys.
