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Home » xLight Appoints GlobalFoundries Executive Chairman Tom Caulfield to Board

xLight Appoints GlobalFoundries Executive Chairman Tom Caulfield to Board

June 25, 2026
in Semiconductors
A A

xLight has appointed Thomas Caulfield to its Board of Directors as an independent director, adding one of the semiconductor industry’s most experienced executives as the company advances its free-electron laser (FEL) technology for next-generation extreme ultraviolet (EUV) lithography. The company said Caulfield brings more than 30 years of experience spanning semiconductor engineering, executive leadership, and global manufacturing operations.  

Caulfield currently serves as Executive Chairman of GlobalFoundries after previously serving as the company’s CEO. During his career, he has overseen advanced semiconductor manufacturing, technology development, and strategic partnerships across the global chip ecosystem. xLight said his industry perspective will help guide the company’s commercialization efforts and deepen its understanding of customer requirements.  

The appointment comes as xLight expands development of its accelerator-based EUV light source technology, which aims to increase the power and efficiency of lithography systems used to manufacture advanced semiconductors. The Palo Alto startup recently raised $40 million in Series B financing and has secured a proposed $150 million CHIPS R&D award to support construction of its first free-electron laser system at the Albany Nanotech Complex in New York.  

• Thomas Caulfield joins xLight as an independent director.
• Brings more than 30 years of semiconductor industry leadership.
• Currently serves as Executive Chairman of GlobalFoundries.
• Experience spans engineering, executive management, and global manufacturing.
• xLight develops free-electron laser technology for next-generation EUV lithography.
• Company recently announced a proposed $150 million U.S. CHIPS R&D award and previously raised a $40 million Series B financing.  

“His deep experience across the industry gives him unique perspective into the needs of xLight’s customers.”

🌐 Analysis: Caulfield’s appointment further strengthens xLight’s credibility as it transitions from research toward commercialization. His background leading one of the world’s largest semiconductor foundries complements the company’s growing roster of industry veterans, including Executive Chairman Pat Gelsinger, reflecting xLight’s ambition to become a strategic supplier of next-generation EUV light source technology for advanced semiconductor manufacturing.  

xLight
Company Profile
HeadquartersPalo Alto, California, USA
Founded2023
TechnologyFree-Electron Laser (FEL) light source technology for next-generation EUV semiconductor lithography.
MissionDevelop accelerator-driven EUV light sources capable of delivering significantly higher power and wafer throughput than conventional plasma-based EUV systems.
Leadership Executive Chairman: Pat Gelsinger
CEO & Co-Founder: Nicholas Kelez
Newest Board Member Dr. Thomas Caulfield
Executive Chairman of GlobalFoundries and former CEO, appointed Independent Director (June 2026).
Funding $40M Series B financing
$150M proposed U.S. CHIPS R&D award
Target MarketsAdvanced logic, AI accelerators, HBM memory, semiconductor manufacturing equipment, and EUV lithography.
Strategic ObjectiveEnable future semiconductor nodes through dramatically higher-power EUV illumination.
Recent Milestones • Pat Gelsinger appointed Executive Chairman.
• Raised $40M Series B financing.
• Selected for proposed $150M CHIPS R&D award.
• Tom Caulfield joins Board of Directors.
Recent xLight Coverage
Converge Digest
June 2026Tom Caulfield joins the xLight Board of Directors.
June 2026Pat Gelsinger becomes Executive Chairman.
2026Proposed $150M CHIPS R&D award supports first free-electron laser installation.
2025Completed $40M Series B financing.
Technology FocusFree-electron lasers • EUV lithography • Accelerator physics • Advanced semiconductor manufacturing
🌐 We’re Tracking Networking Silicon
Converge Digest tracks the latest developments in networking silicon, AI accelerators, silicon photonics, optical I/O, chiplets, advanced packaging, and semiconductor manufacturing.
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