Amkor Technology is expanding its U.S. advanced packaging footprint with the acquisition of an additional 67-acre parcel adjacent to its semiconductor packaging and test campus in Peoria, Arizona. The move increases the company’s total Arizona footprint to 171 acres and provides additional room for future manufacturing capacity as demand rises for advanced packaging across AI, high-performance computing, automotive, and communications markets.
The Peoria site, located within the city’s Innovation Core district, is already under development as a large-scale advanced semiconductor packaging and test facility. Amkor has said the campus is expected to become the first high-volume advanced packaging OSAT facility in the United States. The additional land gives the company strategic flexibility to scale operations over time as customers increase demand for more sophisticated packaging technologies such as chiplets, 2.5D and 3D integration, system-in-package, and advanced test.
The expansion comes amid growing focus on semiconductor packaging as a critical layer of AI infrastructure. While much attention in recent years has centered on U.S.-based wafer fabrication, advanced packaging has become increasingly important for integrating GPUs, accelerators, high-bandwidth memory, and heterogeneous compute platforms. Amkor’s investment strengthens domestic packaging capacity at a time when the U.S. semiconductor industry is working to build a more resilient supply chain across both front-end manufacturing and backend assembly.
Profile: Amkor Arizona Expansion
“Amkor’s investment in Arizona represents a significant step in building advanced semiconductor manufacturing capacity in the United States,” said Kevin Engel, president and chief executive officer of Amkor Technology. “Our continued expansion in Arizona strengthens our ability to support customers with leading-edge packaging and test solutions while contributing to a more resilient global supply chain.”
🌐 Analysis: Amkor’s Arizona expansion highlights how advanced packaging is becoming a strategic battleground in the semiconductor industry. AI accelerators increasingly rely on advanced packaging techniques to integrate logic dies with high-bandwidth memory and dense interconnects, making backend manufacturing a critical part of overall system performance. The Peoria site places Amkor closer to a growing cluster of U.S.-based semiconductor manufacturing activity, including investments by TSMC, Intel, and Micron Technology.
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