In Focus: Advanced Packaging

Advanced Chip and Circuit Materials (ACCM) introduced Celeritas SMC, a silicon-matched core material for advanced IC substrates designed to reduce ...

Pasqal, through its Canadian subsidiary Aeponyx, launched a new Center of Competency for Photonic Integrated Circuit (PIC) packaging at C2MI ...

Applied Materials introduced a new portfolio of semiconductor manufacturing systems aimed at accelerating production of advanced DRAM and 3D chip ...

Qnity Electronics announced the launch of its Advanced Packaging Innovation Hub, a new online platform highlighting the company’s materials and ...

Intel is positioning advanced packaging as a central pillar of its foundry strategy, outlining how its Embedded Multi-die Interconnect Bridge ...

Intel has appointed Seok-Hee Lee as Executive Vice President of Intel Foundry, placing him in charge of advanced packaging, system integration, back-end ...

Synopsys has introduced the first commercial products that combine its electronic design automation (EDA) software with Ansys multiphysics technology, marking ...

Qnity Electronics introduced two new advanced packaging materials aimed at next-generation semiconductor packaging applications for AI, high-performance computing, and advanced ...

Kyocera Corporation introduced a new multilayer ceramic core substrate targeting advanced semiconductor packaging for AI processors and switch ASICs, addressing ...

Camtek Ltd. secured a $31 million multi-system order from a leading OSAT, with systems targeted primarily at CoWoS-like advanced packaging flows ...

Amkor Technology has broken ground on its new advanced semiconductor packaging and test campus in Arizona, expanding its total planned ...

GlobalFoundries (GF) spotlighted a broad set of technology innovations at its Technology Summit 2025 – North America in Santa Clara, ...

Marvell is sharpening its focus on co-packaged optics (CPO) and advanced packaging as key enablers for next-generation AI data centers. At the company's Investor ...