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Amkor Technology and NVIDIA signed a multi-year strategic partnership to expand advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms.…
Qnity Electronics announced the launch of its Advanced Packaging Innovation Hub, a new online platform highlighting the company’s materials and process technologies for advanced…
Amkor Technology is expanding its U.S. advanced packaging footprint with the acquisition of an additional 67-acre parcel adjacent to its semiconductor packaging and test…
Amkor Technology has broken ground on its new advanced semiconductor packaging and test campus in Arizona, expanding its total planned investment to $7 billion.…
Amkor Technology will build its new U.S. advanced packaging and test facility on a 104-acre site within the Peoria Innovation Core in north Peoria,…
Apple announced a new $100 billion commitment to U.S.-based innovation and manufacturing under a bold initiative called the American Manufacturing Program (AMP). This announcement brings…
At the Intel Direct event in San Jose, Kevin O’Buckley, SVP and GM of Intel Foundry Services, delivered a candid address focused on aligning…
NVIDIA announced its commitment to begin manufacturing AI infrastructure solutions in the United States. For the first time, the company will produce entire AI…
At OFC 2025, Lightmatter introduced two groundbreaking products—Passage™ M1000 and Passage™ L200/L200X—that redefine the future of AI infrastructure by delivering record-breaking bandwidth and eliminating interconnect bottlenecks. These next-generation…
The U.S. Department of Commerce has awarded Amkor Technology Arizona, Inc. up to $407 million under the CHIPS Incentives Program to establish a state-of-the-art…
Lightmatter selected GlobalFoundries (GF) to mass-produce its “Passage,” a 3D-stacked silicon photonics platform designed to meet the escalating demands of AI and high-performance computing…
Lightmatter and Amkor Technology have partnered to develop what the companies say is the world’s largest 3D-packaged photonics chip complex, powered by Lightmatter’s Passage…
Amkor Technology and TSMC agreed to collaborate on advanced semiconductor packaging and testing capabilities in Arizona. The agreement involves Amkor providing turnkey advanced packaging…
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