Amkor Technology and NVIDIA signed a multi-year strategic partnership to expand advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms. As part of the agreement, NVIDIA will provide a $1.5 billion prepayment to support the expansion of Amkor’s advanced packaging capacity in Arizona, strengthening U.S.-based manufacturing for AI infrastructure.
The companies said they will align long-term technology roadmaps spanning advanced packaging, high-density interconnect technologies, heterogeneous integration, and production-scale test capabilities. Amkor already packages and tests devices across NVIDIA’s portfolio of AI accelerators, networking silicon, and data center processors. The expanded agreement is intended to increase manufacturing capacity as demand continues to grow for AI infrastructure.
The partnership also advances broader efforts to expand semiconductor manufacturing within the United States while maintaining Amkor’s global manufacturing network across Asia and North America. Amkor said the Arizona expansion will complement its existing worldwide operations, providing geographically diverse manufacturing capacity for AI platforms while supporting resilient semiconductor supply chains.
| Key Technical Highlights | |
| Agreement Value | $1.5 billion multi-year capacity and development agreement |
| Primary Focus | Advanced semiconductor packaging and test for AI infrastructure |
| Technologies | High-density interconnects, heterogeneous integration, advanced packaging, system integration |
| U.S. Investment | Expansion of advanced packaging capacity in Arizona |
| Applications | AI accelerators, data center processors, networking chipsets, accelerated computing platforms |
| Strategic Goal | Expand turnkey U.S. packaging and test while maintaining a diversified global supply chain |
“AI is driving a generational shift in technology, transforming every industry and creating a unique opportunity to reinvigorate American manufacturing and supply chains. Amkor’s global capabilities, combined with their committed investment in the United States, are critical components of building resilient AI infrastructure and accelerating next-generation technologies,” said Debora Shoquist, Executive Vice President of Operations at NVIDIA.
🌐 Analysis
Advanced packaging has become one of the primary bottlenecks in AI infrastructure deployment as modern GPUs, networking ASICs and high-bandwidth memory require increasingly sophisticated integration technologies. Investment has expanded beyond wafer fabrication into advanced packaging, assembly and test, where capacity remains constrained across the industry.
The agreement further demonstrates NVIDIA’s strategy of securing critical manufacturing capacity throughout its supply chain. Recent AI infrastructure investments have increasingly included packaging partners alongside foundries, reflecting the growing importance of heterogeneous integration and advanced packaging in delivering next-generation AI systems at scale.
