• Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Wednesday, June 3, 2026
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » ARM Advances Cortex-A73 on TSMC 16FFC Process

ARM Advances Cortex-A73 on TSMC 16FFC Process

June 7, 2016
in All
A A

ARM today announced the availability of ARM® Artisan® physical IP, including POP™ IP, for

ARM advanced the timeline for mainstream mobile SoCs based on the new ARM Cortex-A73 processor on the TSMC 16FFC (FinFET Compact) process by releasing “Artisan” physical IP to help its SoC partner with their development.

ARM taped out the first TSMC 16FFC test chip incorporating Cortex-A73 POP IP in early May 2016. ARM said this new chip is enabling  partners to move quickly towards the validation of key performance and power metrics for their products. The Cortex-A73 is part of the latest ARM mobile IP suite and it has been designed to deliver significant increases in sustained performance and efficiency compared with the Cortex-A72.

“When designing mainstream mobile SoCs, design teams are challenged to balance implementation and optimization efforts with cost-efficiencies,” said Will Abbey, general manager, physical design group, ARM. “Our latest physical IP collaboration with TSMC addresses this challenge by providing ARM partners with the best SoC optimization solution available for the Cortex-A73. An optimized Cortex-A73 POP solution will help our partners to accelerate their own core implementation knowledge and enable faster time to tape out.”

http://www.arm.com

Tags: ARMBlueprint columnsSilicon
ShareTweetShareSummarizeSummarize
Previous Post

WSJ: Key Engineering Team at Cisco Resigns

Next Post

Telia Carrier Provides Global IP Backbone for Ericsson IoT

Staff

Staff

Related Posts

Automotive Networking

Wayve Adds AMD, Arm, and Qualcomm in $60M Series D 

April 15, 2026
Enterprise

IBM and Arm Signal Shift Toward Heterogeneous Enterprise Compute

April 6, 2026
Semiconductors

Arm Unveils AGI CPU, Enters Data Center Silicon Market

March 24, 2026
All

Arm Guides Q4 FY2026 Revenue to $1.47B as AI Drives Core-Count Growth

February 4, 2026
Semiconductors

Arm Positions CPUs at the Center of the Agentic AI Data Center

January 9, 2026
Semiconductors

Arm Extends Neoverse With NVIDIA NVLink Fusion

November 17, 2025
Next Post

Telia Carrier Provides Global IP Backbone for Ericsson IoT

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version