• Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Monday, June 1, 2026
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Broadcom Demos B-Directional 10 GigE using PCI Express 2.0

Broadcom Demos B-Directional 10 GigE using PCI Express 2.0

September 17, 2007
in Uncategorized
A A

Broadcom demonstrated 10 Gigabit Ethernet (10GbE) bi-directional line rate network performance utilizing only four lanes (x4) of PCI Express 2.0 (PCIe 2.0), thereby greatly reducing system resource requirements for 10 Gbps Ethernet controllers.

The demonstration features the Broadcom BCM57710 converged network interface controller (C-NIC) in conjunction with the advanced PCIe 2.0 host bus interface on an Intel next-generation server platform. Using only four lanes of the PCI Express interface, Broadcom delivers bi-directional line rate performance to the host server that provides a performance gain two times greater than that achieved with products utilizing the previous generation of PCI Express technology.

The BCM57710 can support up to eight lanes of PCIe 2.0 or PCIe 1.1 and enables either 5 Gbps or 2.5 Gbps data rate per lane. Equivalent functionality previously required eight lanes of PCIe 1.1 bus connectivity that doubled the amount of signaling overhead in previous generation server systems.

http://www.broadcom.com

Tags: AllBroadcomSilicon
ShareTweetShareSummarizeSummarize
Previous Post

ECI Extends its Optical Portfolio with AccessWave CWDM

Next Post

Ooma Launches a Premium Consumer VoIP Service

Staff

Staff

Related Posts

5G / 6G / Wi-Fi

Broadcom and Samsung Link 5G Release 17 Modem with Wi-Fi 8

May 27, 2026
Last Mile / Middle Mile

Broadcom Adds 50G PON Edge AI Gateway SoC

May 26, 2026
Semiconductors

Broadcom Joins Applied Materials EPIC to Accelerate Chip Packaging

May 21, 2026
Semiconductors

Broadcom Pushes Wi-Fi 8 into Volume Markets with Integrated 10G PON Silicon

May 1, 2026
Clouds and Carriers

Broadcom and Google Cloud Expand Observability

April 22, 2026
Semiconductors

Broadcom Lands Major Meta AI Silicon Win With Multi-Generation MTIA Deal

April 14, 2026
Next Post

Ikanos and Wintegra Offer Ethernet Bonding for VDSL2

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version