Accelsius closed a $65 million Series B funding round to accelerate deployment of its two-phase, direct-to-chip liquid cooling technology for AI and high-performance computing data centers. The round was led by Johnson Controls, with strategic investment from Legrand, underscoring growing demand for liquid cooling systems capable of supporting next-generation AI workloads at higher rack densities.
The funding supports the rollout of Accelsius’ MR250, the company’s first row-based Coolant Distribution Unit, designed to scale two-phase, direct-to-chip cooling across AI and HPC environments. Accelsius reports that current IT racks can already reach 130 kilowatts, while air cooling can account for up to 40 percent of total data-center power consumption. Its NeuCool platform uses non-conductive fluids in closed loops to address these thermal constraints, targeting improved efficiency and lower operating costs compared with single-phase approaches.
Accelsius plans to use the Series B capital to expand manufacturing capacity in Austin, accelerate global market entry, and advance proprietary high-capacity thermal reference designs. The company is a member of the NVIDIA Inceptionprogram and recently announced an agreement to deploy NeuCool technology across a 300 MW campus for DarkNXin Ontario.
- Series B funding total: $65 million, led by Johnson Controls with participation from Legrand
- Product highlight: MR250 row-based CDU for two-phase, direct-to-chip cooling
- Target workloads: AI and high-performance computing at high rack densities
- Reported benefits: up to 35% OpEx savings versus single-phase D2C and 8–17% TCO savings
- Expansion plans: Austin manufacturing scale-up and global deployment
“We are witnessing the dawn of a new era in digital infrastructure, where the ‘AI Factory’ replaces the traditional data center,” said Josh Claman, Chief Executive Officer of Accelsius. “The investment from Johnson Controls and Legrand is about more than just capital; it signals accelerating adoption of two-phase approaches that deliver high-performing AI solutions with unmatched efficiency.”
🌐 Analysis
Strategic investments from established building and infrastructure suppliers signal tighter alignment between data-center mechanical systems and IT architecture as AI rack densities continue to rise. Accelsius’ focus on two-phase direct-to-chip cooling places it alongside a growing set of vendors targeting liquid-first designs, while competitors and hyperscalers increasingly evaluate standardized CDU reference architectures to support multi-hundred-megawatt AI campuses.
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