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AMD has acquired MEXT, a startup specializing in AI-driven memory optimization software designed to improve memory efficiency across modern compute infrastructure. The move expands AMD’s AI and data center portfolio...

IQE and  Tower Semiconductor⁠ announced a multi-year agreement for the supply of Indium Phosphide (InP) epiwafers that will support silicon photonics technologies aimed at AI-driven data center infrastructure. The agreement...

Huawei Cloud introduced a new “Agentic Infra” architecture and a broad portfolio of AI infrastructure, model development, and agent orchestration products at its INSPIRE 2026 conference in Shanghai. The company...

Google’s Nuvem and Sol subsea cable systems have officially landed in Bermuda, marking a significant expansion of the island’s international digital infrastructure and reinforcing its role as a strategic connectivity...

GigaDevice introduced two new microcontroller families designed specifically for optical communication modules, expanding its portfolio for both high-speed and low-speed optical interconnect applications. The new GD32E512 and GD32E252 series MCUs...

Exyte has secured three major AI-driven data center projects in the Greater Frankfurt region, with a combined order value of nearly €750 million. The projects were awarded by international hyperscalers...

Amazon Web Services (AWS) has made its new Graviton5 processor generally available, positioning the Arm-based CPU as a key platform for the growing class of agentic AI applications that require...

Arista Networks introduced its new 7060XE7 Series, a family of 1.6 Terabit Ethernet platforms designed to serve as the networking foundation for next-generation AI clusters. The portfolio expands Arista’s Etherlink...

Nokia introduced Deepfield Genome Shield, a new security automation platform designed to provide proactive, always-on DDoS protection for service providers, hosting companies, internet exchange points, and cloud operators. The company...

SpaceX is exploring an ambitious concept for deploying AI compute infrastructure in Low Earth Orbit (LEO), leveraging Starship launch capacity, Starlink networking technology, and solar-powered satellite platforms to create what...

Qnity Electronics introduced two new advanced packaging materials aimed at next-generation semiconductor packaging applications for AI, high-performance computing, and advanced connectivity systems. The company announced its Intervia™ 8540HSP multi-role copper...

NTT DATA and Google Cloud announced an expanded strategic collaboration aimed at helping enterprises move beyond AI pilot projects and deploy agentic AI solutions at production scale. The initiative combines...

Mplify announced that three of the world’s largest Internet Exchanges — AMS-IX, DE-CIX, and LINX — have joined its alliance to collaborate on the evolution of Lifecycle Service Orchestration (LSO) APIs for IP peering,...