Optical I/O

Converge Digest tracks Optical I/O as a critical architecture for scaling AI infrastructure beyond the limits of electrical interconnects. Coverage spans optical links moving closer to processors, GPUs, XPUs, memory and advanced packages, with a focus on reducing power consumption, increasing bandwidth density and enabling next-generation AI compute fabrics.
Tracking: Optical I/O • VCSELs • MicroLEDs • Silicon Photonics • Co-Packaged Optics • Advanced Packaging • AI Scale-Up • Chip-to-Chip Links • Memory Connectivity • Optical Interconnects

Ayar Labs Raises $500M to Scale CPO

Ayar Labs secured $500 million in Series E funding to accelerate high-volume production of its co-packaged optics (CPO) technology aimed at AI scale-up infrastructure. The round was led by Neuberger...

Lightmatter and Cadence Collaborate on CPO 

Lightmatter announced a technical collaboration with Cadence to develop co-packaged optics (CPO) solutions that combine Cadence’s silicon-proven high-speed SerDes and UCIe IP with Lightmatter’s Passage optical engine. The effort targets hyperscale AI and...

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