Avicena Unveils MicroLED Optical I/O Evaluation Platform

In Focus: Avicena

💡 Avicena

LightBundle™ Optical Interconnect Technology for AI Scale-Up Networks

Avicena is a privately held semiconductor company developing ultra-high-density optical interconnect technology for AI systems and high-performance computing. Its LightBundle™ platform combines microLED transmitters with silicon-based receivers to deliver short-reach optical links that provide high bandwidth while reducing power consumption compared with conventional electrical interconnects. The technology targets chip-to-chip, package-to-package and board-level communications inside next-generation AI servers.

Why It Matters

As AI clusters continue to scale, conventional copper interconnects increasingly face limitations in bandwidth density, reach and power efficiency. Avicena is developing optical interconnect technology that extends optical connectivity deeper into the server, helping overcome electrical bottlenecks between GPUs, CPUs, memory and accelerator devices.

Founded

2019

Headquarters

Sunnyvale, California, USA

Chief Executive Officer

Marco Chisari

Chief Technology Officer

Bardia Pezeshki (Co-founder)

Core Technologies

LightBundle™ • MicroLED Optical Interconnects • Parallel Optical I/O • Chip-to-Chip Optical Links • Board-Level Optical Interconnects • Ultra-Low-Power Optical Communications

Target Applications

AI Servers • GPU Clusters • Scale-Up Networks • High-Performance Computing • Memory Expansion • Accelerator Fabrics • Advanced Packaging

Technology Position

Avicena’s LightBundle architecture is designed for ultra-short-reach optical communications inside AI servers and compute systems. Unlike pluggable optics or long-reach silicon photonics, the company’s technology replaces high-speed electrical traces with massively parallel optical links that improve bandwidth density while reducing power consumption.

Editorial Coverage

Converge Digest tracks Avicena across AI infrastructure, optical I/O, scale-up networking, microLED communications, advanced packaging, chiplet architectures, co-packaged optics and next-generation data center connectivity.

Industry Context

Growing AI workloads are driving renewed interest in moving optical connectivity closer to processors and memory. Alongside advances in co-packaged optics, linear pluggable optics and optical I/O, companies such as Avicena are developing architectures that reduce power consumption while increasing bandwidth density within AI compute systems.

Related Knowledge Hubs

Avicena •
AI Infrastructure •
Optical Networking •
Optical I/O •
Co-Packaged Optics •
Advanced Packaging