Lightmatter has joined the Ultra Accelerator Link Consortium (UALink) as a Contributor member to help establish high-speed, low-latency open interconnect standards for AI systems. Using its Passage™ technology—a 3D-stacked photonic...
Ayar Labs secured $155 million in Series D funding to advance its optical I/O technology for AI infrastructure. The round, led by Advent Global Opportunities and Light Street Capital, included...
It's been a busy year at Ayar Labs, which is pushing ahead with its mission to solve optical I/O bottlenecks. At the Optical Fiber Communication (OFC) Conference in March, Ayar...
Lightmatter selected GlobalFoundries (GF) to mass-produce its "Passage," a 3D-stacked silicon photonics platform designed to meet the escalating demands of AI and high-performance computing (HPC) infrastructure. Passage aims to deliver...
Lightmatter has announced a strategic collaboration with Advanced Semiconductor Engineering, Inc. (ASE), the world’s largest semiconductor packaging and testing provider, to advance the Passage™ platform. Passage is the world’s first...
Lightmatter and Amkor Technology have partnered to develop what the companies say is the world’s largest 3D-packaged photonics chip complex, powered by Lightmatter’s Passage platform. The collaboration brings together Lightmatter’s...
Lightmatter, based in Mountain View, has raised $400 million in a Series D round, bringing its valuation to $4.4 billion. The funding, led by investors advised by T. Rowe Price...
The 2024 ECOC Exhibition in Frankfurt, Germany this week attracted more than 330 exhibitors from around the globe and over 7,800 visitors. Here are the 30 news items in our...
At the ECOC24 Exhibition in Frankfurt, the following award winners and companies were announced: Best Fibre/Fibre Component Product Award: Winner! Sumitomo Electric Europe Limited for 2C Z-PLUS Fiber ULL Teramount...
At ECOC 2024 in Frankfurt, Avicena unveiled a major advancement in its LightBundle technology, extending the reach of its microLED-based optical interconnects to 30 meters, tripling the previous demonstration of...
Conventional thinking holds that Light Emitting Diodes (LED) are too slow for communication links, right? What are microLEDs? Is it possible for microLEDs on a chip to scale to terabit...
At ECOC24, Sivers Semiconductors and Ayar Labs will jointly demonstrate the integration of Sivers’ 16-wavelength distributed feedback (DFB) laser array into Ayar Labs’ SuperNova multi-wavelength light source, delivering 16 Tbps...
Discover the benefits of Heterogeneous Integration as it enables miniaturization, simplifies interconnection, and reduces energy consumption. Join the panel discussion on March 24th featuring industry experts from around the world....
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