Ayar Labs Raises $500M to Scale CPO
Ayar Labs secured $500 million in Series E funding to accelerate high-volume production of its co-packaged optics (CPO) technology aimed at AI scale-up infrastructure. The round was led by Neuberger...
Optical
Photonic technologies, chip-to-chip, optical interconnects, DCI, metro and long-haul connectivity
Huawei Embeds OTDR into 5G-A Transport
Huawei upgraded its 5G-Advanced (5G-A) mobile transport portfolio in Barcelona with a new Fiber Health Care (FHC) solution that embeds optical diagnostics directly into the network. The system integrates built-in...
TensorWave taps Credo ZeroFlap Cables and Optics for AMD AI Clusters
TensorWave teamed up with Credo Technology Group to deploy Credo’s ZeroFlap (ZF) Active Electrical Cables (AECs) and optical transceivers across TensorWave’s next-generation AMD-based AI cluster builds. Credo said the design...
PhotonIC Launches ROCS Platform to Qualify Optoelectronic ICs
Singapore-based PhotonIC Technologies introduced a product portfolio built on its Resiliency of Optoelectronic Chip Supply-Chain (ROCS) platform, positioning the approach as a way for module and system vendors to diversify...
Ciena Debuts 6.4T Vesta 200 CPO Engine Targeting 200G/Lane AI Fabrics
Ciena introduced its Vesta 200 6.4T CPX pluggable co-packaged optical (CPO) engine, targeting hyperscale AI data centers that require higher density and lower power at 200G per lane. The launch...
IP Infusion Targets 400G/800G IPoDWDM and AI Data Center Fabrics
IP Infusion introduced OcNOS 7.0 at Mobile World Congress 2026 in Barcelona, positioning the new release as a platform for AI data center fabrics and open converged IP/optical transport at...
1Finity Launches Open 800G+ Optical Line System for AI-Scale Networks
1Finity, a Fujitsu company, introduced its Ultra Optical System L1000/L2000, a next-generation open optical line system (OLS) designed to support 800G and higher-capacity transport for AI-driven networks. The platform targets...
Lightera Group Advances MMC Connector Ecosystem for Co-Packaged Optics
Hakusan, SANWA Technologies and US Conec have signed agreements to expand multi-sourcing and development of MMC Very Small Form Factor (VSFF) multi-fiber optical connector and TMT ferrule solutions, targeting hyperscale...
Meta and NVIDIA Deepen Co-Design Across CPUs, GPUs and AI Networking
Meta is expanding its AI infrastructure through a multiyear, multigenerational partnership with NVIDIA, deploying millions of Blackwell and Rubin GPUs alongside NVIDIA CPUs and Spectrum-X networking across its global data center...
Molex Unveils 224Gbps PAM-4 Impress Co-Packaged Copper for AI Servers
Molex introduced its Impress Co-Packaged Copper Solutions, targeting next-generation AI servers and high-density data center systems operating at 224Gbps PAM-4 and higher. The Lisle, Illinois-based connectivity supplier designed Impress as...
Tower and Scintil Roll Out First Heterogeneous DWDM Lasers
Tower Semiconductor and Scintil Photonics introduced what they describe as the first heterogeneously integrated DWDM laser sources designed for AI infrastructure, combining monolithic laser integration with high-volume silicon photonics manufacturing. The companies said...
Tower Semiconductor, NVIDIA Align on 1.6T Silicon Photonics
Tower Semiconductor said it is working with NVIDIA to support 1.6T data center optical modules aimed at next-generation AI infrastructure, using its silicon photonics (SiPho) manufacturing platform. The collaboration focuses...
Lam, CEA-Leti Target New Materials for RF, Photonics, and Optical Interconnect
Lam Research and CEA-Leti signed a new multi-year research agreement aimed at accelerating the development of next-generation specialty semiconductor devices with improved energy efficiency. The collaboration targets emerging applications spanning...
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