Marvell and Lumentum demonstrated a rack-scale optical circuit switching (OCS) system designed to improve scalability and efficiency in AI cluster interconnects. The system integrates Marvell’s optical connectivity silicon with Lumentum’s...
Keysight and Broadcom demonstrated interoperability of Ultra Ethernet Consortium technologies at full 800 GbE line rate, showcasing link-layer mechanisms designed to address congestion, reliability, and latency challenges in large-scale AI...
AFL, Corning Incorporated, Lightera, and Prysmian issued a joint statement on March 16, 2026 affirming their ability to supply Build America, Buy America (BABA)-compliant fiber and cable for the full...
The Advanced Photonics Coalition (APC) reported membership growth to more than 50 companies, adding 10 new organizations in 2026 as the industry accelerates efforts to standardize silicon photonics manufacturing for...
LOS ANGELES — The scale of optical connectivity required for future AI infrastructure may be far larger than the industry currently expects, according to Andy Bechtolsheim, co-founder and CTO of...
NewPhotonics unveiled its Syncra micro-ring modulator (MRM) platform at OFC 2026 in Los Angeles, introducing a heaterless silicon photonics design intended to reduce power consumption and thermal constraints in next-generation...
OFC 2026 is underway this week at the Los Angeles Convention Center, bringing together the global optical networking industry at a moment when artificial intelligence infrastructure is reshaping the entire...
By Fady Masoud, Senior Director, Solutions Marketing at Nokia The massive scale of AI model training, inference and data movement between distributed compute clusters is dramatically increasing east-west and data center...
A group of optical connectivity vendors including Ciena, Coherent, Marvell, Molex, Samtec, and TeraHop announced the formation of the Open CPX MSA, a new industry initiative focused on defining common...
Corning introduced PRIZM TMT technology as part of an expansion of its AI data center connectivity portfolio, positioning the platform to address the growing fiber density demands of large-scale AI...
Keysight Technologies introduced new 224G test solutions designed to support the development and manufacturing of next-generation 1.6T optical and electrical interconnects for AI data centers. The portfolio expands Keysight’s end-to-end...
Arista Networks announced the formation of the XPO (eXtra-dense Pluggable Optics) Multi-Source Agreement (MSA), an industry initiative aimed at defining a next-generation pluggable optical module optimized for large-scale AI infrastructure. The...
A new industry consortium called the Optical Compute Interconnect (OCI) Multi-Source Agreement (MSA) has formed to develop an open optical interconnect specification for next-generation AI infrastructure. Founding members include AMD,...
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