• Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Wednesday, June 3, 2026
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » MACOM to Manufacture HRL’s 40nm GaN-on-SiC Process

MACOM to Manufacture HRL’s 40nm GaN-on-SiC Process

November 4, 2025
in Semiconductors
A A

MACOM Technology Solutions has signed an agreement with HRL Laboratories to license and manufacture HRL’s proprietary 40nm T3L GaN-on-silicon carbide (GaN-on-SiC) process technology. The collaboration will transfer production from HRL’s research facilities to one of MACOM’s U.S. Trusted Foundries, giving MACOM an exclusive license to produce devices using the advanced T3L process.

Developed under U.S. defense research initiatives including the OUSD’s State-of-the-Art Radio Frequency Gallium Nitride (STARRY NITE) and DARPA’s Dynamic Range Electronics and Materials (DREaM) programs, HRL’s T3L process integrates a proprietary epitaxial structure and advanced gate design for high performance and reliability at millimeter-wave frequencies. The process supports both commercial and defense applications, strengthening MACOM’s existing RF, microwave, and millimeter-wave product lines.

“T3L is one of the most advanced high frequency semiconductor processes in the industry, which we anticipate will enhance our existing portfolio and accelerate execution of our roadmap,” said Stephen G. Daly, President and CEO of MACOM. HRL CEO Rob Vasquez added, “This new relationship with MACOM demonstrates HRL’s expertise at developing and proving technology concepts and then transitioning them into production.”

• MACOM gains exclusive manufacturing rights to HRL’s 40nm T3L GaN-on-SiC process

• The transfer will occur to a U.S. Trusted Foundry under a rapid collaboration framework

• HRL’s T3L technology originated from DARPA and OUSD-funded defense programs

• The process targets both commercial and defense millimeter-wave applications

🌐 Analysis: This collaboration deepens MACOM’s GaN capabilities at a time when U.S. defense and telecom sectors are seeking domestic, trusted semiconductor production. The deal positions MACOM alongside firms like Qorvo and Wolfspeed that are scaling GaN-on-SiC for radar, 5G, and high-power RF systems, while strengthening HRL’s role as a key innovation pipeline from federally funded R&D to industrial manufacturing.

🌐 We’re tracking the latest developments in networking silicon. Follow our ongoing coverage at: https://convergedigest.com/category/semiconductors

ShareTweetShareSummarizeSummarize
Previous Post

Tracking OpenAI’s Global AI Infrastructure

Next Post

EXA Infrastructure Deploys FiberSense Monitoring in Italy

Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

Related Posts

All

Trans Pacific Networks Taps Indigo for Subsea Operations

May 26, 2026
Last Mile / Middle Mile

Broadcom Adds 50G PON Edge AI Gateway SoC

May 26, 2026
Subsea

Biznet Upgrades BNCS-1 Subsea Net with Ciena across Indonesia

May 26, 2026
All

AMD Commits $10 Billion to Taiwan Ecosystem

May 26, 2026
Quantum

QuiX Quantum Unveils Photonic Assembly Control Unit

May 26, 2026
Data Centers

NextSilicon’s Spectra Supercomputer at Sandia

May 26, 2026
Next Post

EXA Infrastructure Deploys FiberSense Monitoring in Italy

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • About
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Manage Email Delivery
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version