Marvell Technology has announced a collaboration with NVIDIA to integrate NVLink Fusion into its custom cloud platform silicon, offering hyperscalers greater flexibility to build advanced AI infrastructure. NVLink Fusion, launched...
At Computex 2025 in Taipei, Intel unveiled major updates to its AI accelerator and GPU portfolio, placing a strong focus on scalable deployment options for its Gaudi 3 architecture. Designed...
Astera Labs announced it is extending its collaboration with NVIDIA to support the NVLink Fusion ecosystem, introducing new scale-up connectivity solutions as part of its Intelligent Connectivity Platform. The move...
Broadcom has launched its third-generation co-packaged optics (CPO) platform featuring 200G per lane optical connectivity, pushing the performance envelope for AI-scale networks. The company also reaffirmed the maturity of its...
Finwave Semiconductor secured $8.2 million in bridge funding to accelerate the commercialization of its proprietary gallium nitride on silicon (GaN-on-Si) technology for high-performance RF applications. The round was led by...
Check out other Tech Updates on our YouTube Channel (subscribe today): https://www.youtube.com/@NextGenInfra and check out our latest reports at: https://nextgeninfra.io/ Pierre-Yves Lesaicherre, CEO of Finwave Semiconductor, describes how the company’s...
Corning announced a strategic collaboration with Broadcom to supply critical optical components for the Bailly co-packaged optics (CPO) system—Broadcom’s 51.2 Tbps Ethernet switch targeting AI-driven data centers. The partnership advances...
Cadence introduced a new category of AI silicon with the launch of the Tensilica NeuroEdge 130 AI Co-Processor (AICP), designed to complement NPUs and offload non-MAC AI tasks such as...
Infineon Technologies has introduced a new trench-based silicon carbide (SiC) superjunction (TSJ) technology, aiming to push the performance boundaries of electric vehicle drivetrains and high-power industrial systems. Building on its...
Broadcom has released its Scale Up Ethernet (SUE) Framework, a new architectural specification designed to optimize intra-rack and multi-rack communication for AI and HPC clusters. Built on Ethernet fundamentals and tailored...
VSORA, a French startup specializing in ultra-high-performance AI inference chips, has secured $46 million in funding to bring its Jotunn8 (J8) processor to market. Backed by Otium, a French family...
In his first major keynote as CEO of Intel, Lip-Bu Tan took the stage at the Intel Direct event in San Jose to outline a clear and ambitious vision for...
At the Intel Direct event in San Jose, Kevin O’Buckley, SVP and GM of Intel Foundry Services, delivered a candid address focused on aligning Intel’s foundry roadmap with the fast-evolving...
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