Infineon Technologies has introduced a new trench-based silicon carbide (SiC) superjunction (TSJ) technology, aiming to push the performance boundaries of electric vehicle drivetrains and high-power industrial systems. Building on its...
Broadcom has released its Scale Up Ethernet (SUE) Framework, a new architectural specification designed to optimize intra-rack and multi-rack communication for AI and HPC clusters. Built on Ethernet fundamentals and tailored...
VSORA, a French startup specializing in ultra-high-performance AI inference chips, has secured $46 million in funding to bring its Jotunn8 (J8) processor to market. Backed by Otium, a French family...
In his first major keynote as CEO of Intel, Lip-Bu Tan took the stage at the Intel Direct event in San Jose to outline a clear and ambitious vision for...
At the Intel Direct event in San Jose, Kevin O’Buckley, SVP and GM of Intel Foundry Services, delivered a candid address focused on aligning Intel’s foundry roadmap with the fast-evolving...
At the Intel Direct event in San Jose, Dr. Naga Chandrasekaran, EVP and GM of Intel Foundry Technology and Manufacturing, delivered a sweeping update on Intel’s manufacturing roadmap, emphasizing progress...
DuPont is advancing its plan to spin off its Electronics & Industrial division into a standalone, publicly traded company, currently referred to as Novus SpinCo 1, Inc. The spin-off is...
Intel reported first-quarter 2025 revenue of $12.7 billion, unchanged from a year ago, as gains in its Data Center and AI (DCAI) and Foundry segments were offset by declines in...
TSMC introduced its next-generation A14 logic process at the North America Technology Symposium in Santa Clara, California, outlining a significant performance and power advancement over its forthcoming N2 node. Slated...
Synopsys and TSMC have expanded their long-standing collaboration with certified EDA flows and IP solutions for the latest angstrom-scale nodes, including TSMC’s A16 and N2P processes. The companies are enabling...
Cadence introduced the industry’s first DDR5 12.8Gbps MRDIMM Gen2 memory IP system solution on TSMC’s N3 process node, targeting AI, HPC, and data center workloads that demand high bandwidth and...
Auradine, a start-up based in Santa Clara, California, has secured $153 million in Series C funding to expand its blockchain and AI infrastructure product lines, bringing its total capital raised...
AMD has achieved a key milestone by taping out and bringing up its next-generation EPYC processor, codenamed “Venice,” on TSMC’s 2nm (N2) node. The new chip becomes the first high-performance...
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