Semiconductors

TSMC and the University of Tokyo have inaugurated the “TSMC-UTokyo Lab,” marking TSMC’s first joint research facility with a university outside Taiwan. Located at UTokyo’s Asano campus, the lab will...

Marvell has introduced a production-ready, modular multi-die packaging platform that enables next-generation custom AI accelerators to scale beyond the limits of traditional monolithic silicon designs. The platform integrates a novel...

Xiaomi unveiled its first self-developed flagship chipsets—the XRING O1 3nm SoC and XRING T1 4G smartwatch SoC—during a high-profile product launch in Beijing themed “A New Beginning.” The debut marks a major...

Navitas Semiconductor announced its participation in NVIDIA’s effort to develop an 800V high-voltage direct current (HVDC) architecture aimed at improving power delivery in next-generation AI data centers. The company’s gallium...

DuPont has officially named its upcoming electronics spin-off Qnity, marking a major step in the creation of a standalone materials company aimed squarely at the fast-evolving semiconductor and electronics industries. Set...

Credo Technology has introduced PILOT, a new diagnostics and analytics software platform aimed at enhancing the reliability and performance of high-speed connectivity links across hyperscale data centers and AI infrastructure. The...

GlobalFoundries (GF) has signed a Memorandum of Understanding with Singapore’s Agency for Science, Technology and Research (ASTAR) to accelerate research and development in advanced semiconductor packaging. The collaboration will grant...

Marvell Technology has announced a collaboration with NVIDIA to integrate NVLink Fusion into its custom cloud platform silicon, offering hyperscalers greater flexibility to build advanced AI infrastructure. NVLink Fusion, launched...

At Computex 2025 in Taipei, Intel unveiled major updates to its AI accelerator and GPU portfolio, placing a strong focus on scalable deployment options for its Gaudi 3 architecture. Designed...

Astera Labs announced it is extending its collaboration with NVIDIA to support the NVLink Fusion ecosystem, introducing new scale-up connectivity solutions as part of its Intelligent Connectivity Platform. The move...

Broadcom has launched its third-generation co-packaged optics (CPO) platform featuring 200G per lane optical connectivity, pushing the performance envelope for AI-scale networks. The company also reaffirmed the maturity of its...

Finwave Semiconductor secured $8.2 million in bridge funding to accelerate the commercialization of its proprietary gallium nitride on silicon (GaN-on-Si) technology for high-performance RF applications. The round was led by...

Check out other Tech Updates on our YouTube Channel (subscribe today): https://www.youtube.com/@NextGenInfra and check out our latest reports at: https://nextgeninfra.io/ Pierre-Yves Lesaicherre, CEO of Finwave Semiconductor, describes how the company’s...