Semiconductors

Intel and AMD have formed an x86 Ecosystem Advisory Group to drive the future of the world’s most widely used computing architecture. This new initiative will unite industry leaders to...

Marvell unveiled a custom 5nm network interface controller (NIC) ASIC designed in collaboration with Meta. The new solution, revealed at the 2024 OCP Global Summit, is tailored to meet Meta’s...

AMD has introduced the Pensando Pollara 400, a 400 Gbps RDMA Ethernet Network Interface Card (NIC) designed to meet the demands of modern AI and machine learning (ML) workloads. The...

AMD launched its 5th Gen EPYC processors, codenamed “Turin,” aimed at enterprise, AI, and cloud workloads. Featuring the new “Zen 5” core architecture, these CPUs are compatible with the SP5...

Credo Technology Group has launched its new 800G HiWire ZeroFlap (ZF) Active Electrical Cables (AECs) designed for AI backend networks. These advanced AECs provide enhanced reach, zero soft link flaps,...

Astera Labs unveiled its new Scorpio Smart Fabric Switch portfolio, targeting cloud-scale AI infrastructure with PCIe 6 connectivity. Designed for demanding AI workloads, the Scorpio switches aim to deliver high...

Qualcomm Technologies has introduced its new Networking Pro A7 Elite platform, bringing Wi-Fi 7 connectivity and powerful edge AI processing to home and enterprise networks. Equipped with a Qualcomm Hexagon...

Broadcom launched its 50G PON OLT-ONU merchant silicon platform, integrating AI/ML processing at the edge to accelerate telecom applications. The new chips allow operators to manage high-bandwidth demands while running...

MaxLinear has introduced its MaxAI, a hardware-optimized machine learning (ML) framework aimed at improving quality of service (QoS) for multiple system operators (MSOs). The new technology integrates directly into MaxLinear’s...

Cerebras Systems, a start-up based in Sunnyvale, California, has officially filed for an initial public offering (IPO), aiming to raise capital to expand its operations and capture a larger share...

Fujitsu and Supermicro formed strategic partnership to co-develop and market a high-performance platform based on Fujitsu’s upcoming “FUJITSU-MONAKA” Arm-based processor. Scheduled for release in 2027, the processor is designed to...

HexaTech has secured a multi-year contract with the Defense Advanced Research Projects Agency (DARPA) under the Ultra-Wide Bandgap Semiconductors (UWBGS) program. The project aims to develop 100 mm aluminum nitride...

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