Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
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| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
The U.S. Department of Commerce’s Bureau of Industry and Security (BIS) has introduced a sweeping set of rules to curtail China’s ability to develop advanced semiconductors and artificial intelligence (AI)...
Tenstorrent Secures $693M Series D Funding Led by Samsung Securities and AFW PartnersTenstorrent has raised $693 million in a Series D funding round, valuing the company at $2 billion pre-money....
Marvell Technology announced an expanded five-year agreement with Amazon Web Services (AWS) to supply advanced semiconductor solutions for data centers. The collaboration focuses on integrating Marvell’s silicon products, including custom...
Renesas Electronics introduced the RZ/T2H, its most advanced microprocessor (MPU) for industrial applications to date. Designed for high-speed, high-precision control of up to 9-axis robot motors, the RZ/T2H integrates application...
The U.S. Department of Commerce has awarded Intel Corporation up to $7.865 billion in direct funding under the CHIPS Incentives Program. This investment supports Intel’s expansive U.S. growth strategy, which...
Biden-Harris Administration Awards CHIPS Funding to The U.S. Department of Commerce has finalized CHIPS Incentives Program funding for BAE Systems and Rocket Lab to enhance semiconductor production for national security...
The U.S. Department of Commerce has unveiled plans to invest up to $300 million in advanced semiconductor packaging projects in Georgia, California, and Arizona. The funding, part of the CHIPS...
\GlobalFoundries confirmed that it will receive an award of up to $1.5 billion in direct funding from the CHIPS and Science Act. A preliminary agreement with the U.S. Department of...
Microsoft previewed two new custom chips at its Ignite conference, expanding its in-house silicon portfolio to enhance Azure’s efficiency, security, and performance. The new additions, the Azure Boost DPU and the Azure Integrated...
NVIDIA has introduced the H200 NVL PCIe GPU at the Supercomputing 2024 (SC24) conference, expanding its Hopper architecture portfolio. Designed for air-cooled enterprise racks under 20kW, the H200 NVL offers...
d-Matrix, a start-up based in Santa Clara, California, launched "Corsair", a compute platform designed specifically for AI inference in modern datacenters. Built on d-Matrix’s proprietary Digital In-Memory Compute (DIMC) architecture,...
The U.S. Department of Commerce has awarded TSMC Arizona up to $6.6 billion in direct funding under the CHIPS Incentives Program to bolster domestic semiconductor production. The funding will support...
Lightmatter has announced a strategic collaboration with Advanced Semiconductor Engineering, Inc. (ASE), the world’s largest semiconductor packaging and testing provider, to advance the Passage™ platform. Passage is the world’s first...
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