Corning introduced EXTREME ULE Glass, a new material designed to meet the increasing demands of chipmakers working with extreme ultraviolet (EUV) lithography. This next-generation glass, engineered for high numerical aperture...
Alphawave Semi announced the availability of its 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem. Built on TSMC’s advanced Chip-on-Wafer-on-Substrate (CoWoS) packaging technology, this subsystem is designed...
Sivers Semiconductors has secured $6 million in first-year funding from the Northeast Microelectronics Coalition (NEMC) Hub through the U.S. CHIPS and Science Act. The funding, part of the Microelectronics Commons...
Broadcom, Charter Communications, and Comcast announced a joint effort to develop Unified DOCSIS chipsets, designed to support both FDX and ESD versions of the DOCSIS 4.0 specification. These chipsets are...
Conventional thinking holds that Light Emitting Diodes (LED) are too slow for communication links, right? What are microLEDs? Is it possible for microLEDs on a chip to scale to terabit...
Semtech is now sampling its next-generation Tri-Edge GN2255S, a 50 Gbps clock and data recovery (CDR) with an integrated DML driver for SFP56 50G PAM4 bidirectional (BiDi) and CWDM6 optical...
Broadcom announced the availability of its Sian2 DSP, a 200G per lane PAM-4 DSP PHY, designed to power the next generation of AI data centers. Sian2 supports 200G electrical and...
SiFive, which traces its heritage back to the team that developed the RISC-V instruction set architecture (ISA) at the University of California, Berkeley, launched its latest designs aimed at high-performance...
Intel and Amazon Web Services (AWS) announced a major expansion of their long-term partnership, focusing on co-developing custom chip designs under a multi-billion-dollar, multi-year framework. Intel will produce an AI...
Intel secured up to $3 billion in direct funding under the CHIPS and Science Act to support the Secure Enclave program, which aims to enhance trusted manufacturing of advanced semiconductors...
Credo announced a new line of HiWire Active Electrical Cables (AECs) aimed at China’s growing hyperscale data centers, specifically for the 400G Q112 network port market. These new cables are...
Cerebras Systems has announced a Memorandum of Understanding (MoU) with Saudi Arabia’s Aramco to accelerate the deployment of AI across industries, universities, and enterprises in the region. The agreement focuses...
SambaNova Systems has launched SambaNova Cloud, the world’s fastest AI inference platform powered by its SN40L chip, offering unmatched performance for developers. The platform supports Meta’s popular open-source Llama 3.1...
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