Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
Silicon Pillars AI AcceleratorsNetworking SiliconOptical DSPsChipletsMemorySilicon PhotonicsWireless SoCs |
| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
AMD launched its 5th Gen EPYC processors, codenamed “Turin,” aimed at enterprise, AI, and cloud workloads. Featuring the new “Zen 5” core architecture, these CPUs are compatible with the SP5...
Credo Technology Group has launched its new 800G HiWire ZeroFlap (ZF) Active Electrical Cables (AECs) designed for AI backend networks. These advanced AECs provide enhanced reach, zero soft link flaps,...
Astera Labs unveiled its new Scorpio Smart Fabric Switch portfolio, targeting cloud-scale AI infrastructure with PCIe 6 connectivity. Designed for demanding AI workloads, the Scorpio switches aim to deliver high...
Qualcomm Technologies has introduced its new Networking Pro A7 Elite platform, bringing Wi-Fi 7 connectivity and powerful edge AI processing to home and enterprise networks. Equipped with a Qualcomm Hexagon...
Broadcom launched its 50G PON OLT-ONU merchant silicon platform, integrating AI/ML processing at the edge to accelerate telecom applications. The new chips allow operators to manage high-bandwidth demands while running...
MaxLinear has introduced its MaxAI, a hardware-optimized machine learning (ML) framework aimed at improving quality of service (QoS) for multiple system operators (MSOs). The new technology integrates directly into MaxLinear’s...
Cerebras Systems, a start-up based in Sunnyvale, California, has officially filed for an initial public offering (IPO), aiming to raise capital to expand its operations and capture a larger share...
Fujitsu and Supermicro formed strategic partnership to co-develop and market a high-performance platform based on Fujitsu’s upcoming “FUJITSU-MONAKA” Arm-based processor. Scheduled for release in 2027, the processor is designed to...
HexaTech has secured a multi-year contract with the Defense Advanced Research Projects Agency (DARPA) under the Ultra-Wide Bandgap Semiconductors (UWBGS) program. The project aims to develop 100 mm aluminum nitride...
Check out other Tech Updates on our YouTube Channel (subscribe today): https://www.youtube.com/@NextGenInfra and check out our latest reports at: https://nextgeninfra.io/ In this conversation, Jim Carroll and Armond Hairapetian discuss the...
Corning introduced EXTREME ULE Glass, a new material designed to meet the increasing demands of chipmakers working with extreme ultraviolet (EUV) lithography. This next-generation glass, engineered for high numerical aperture...
Alphawave Semi announced the availability of its 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem. Built on TSMC’s advanced Chip-on-Wafer-on-Substrate (CoWoS) packaging technology, this subsystem is designed...
Sivers Semiconductors has secured $6 million in first-year funding from the Northeast Microelectronics Coalition (NEMC) Hub through the U.S. CHIPS and Science Act. The funding, part of the Microelectronics Commons...
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