Silicon for AI, Cloud, Telecom and Digital Infrastructure Converge Digest tracks the semiconductor platforms powering next-generation networks, AI clusters, optical systems, data centers, wireless infrastructure and edge devices. |
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| Tracking: Tapeouts • Process Nodes • Packaging • Foundry Partnerships • AI Inference • Ethernet Switching • Coherent Optics • Memory Bandwidth • Power Efficiency • Supply Chain |
Broadcom has begun sampling its latest FBAR integrated front end module (FiFEM) devices for Wi-Fi access point (AP) applications, spanning Wi-Fi routers, residential gateways, and enterprise APs, enabling 5 GHz...
Apple's new flagship M2 Ultra system on a chip (SoC) is built using a second-generation 5-nanometer process and the company's "UltraFusion" silicon interposer technology to connect the die of two...
Intel announced the first implementation of its PowerVia backside power delivery technology in a product-like test chip. PowerVia solves the growing issue of interconnect bottlenecks in area scaling by moving...
Renesas has acquired Panthronics AG, a fabless semiconductor company headquartered in Graz, Austria, specializing in high-performance wireless products. Panthronics offers advanced NFC chipsets and software that are easy to apply,...
Broadcom reported Q2 consolidated revenue of $8.7 billion, up 8% year-over-year, and adjusted EBITDA margin of 65%. "Broadcom's second quarter results were driven by demand for next generation technologies from...
Arm introduced its Total Compute Solutions 2023 (TCS23) platform for mobile computing. TCS23 is designed and optimized for specific workloads that need to run seamlessly together as a complete system....
Cadence Design Systems, in collaboration with Arm , is targeting a faster path to tapeout through use of Cadence digital and verification tools and the new Arm Total Compute Solutions...
Taiwan-based JPC Connectivity has selected MaxLinear’s 5nm Keystone PAM4 DSP to produce 800G active electrical cables for hyperscale datacenters. MaxLinear said its Keystone can yield up to a 40% power...
MaxLinear introduced a new line of 2.5G Ethernet products, including new 2.5G Ethernet switches and eight port 2.5G Enterprise PHYs. MXL862XX 2.5G Octal Switch/PHY Key Features Integrated 16 port Switch...
Apple signed a new multiyear, multibillion-dollar agreement with Broadcom for 5G radio frequency components — including FBAR filters — and cutting-edge wireless connectivity components. The FBAR filters will be designed...
Applied Materials plans to invest up to $4 billion over the next 7 years in Silicon Valley to build "the world’s largest and most advanced facility for collaborative semiconductor process...
Meta unveiled a highly optimized device for processing video for live-streaming, video on demand (VOD), AR/VR, and AI-generated content across the Meta family of applications. The Meta Scalable Video Processor...
Samsung Electronics started mass production of 16-gigabit (Gb) DDR5 DRAM designed for data center servers, HPC clusters, etc. The new chips are based on the most advanced 12 nanometer (nm)-class...
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