The Chiplet Summit recognized three companies for technical innovation at its 2026 Best of Show Awards, held at the Santa Clara Convention Center. Organizers presented awards across design, interoperability, and hardware packaging categories as the chiplet ecosystem accelerates adoption in AI, high-performance computing, and communications silicon.
Siemens EDA won in the “Packaging: Design” category for its Innovator3D IC software, which supports planning and heterogeneous integration of ASICs and chiplets across 2.5D and 3D packaging architectures. The tool targets design teams building multi-die systems that combine logic, memory, and accelerators within a single package.
The UCIe Consortium received the “Connectivity and Interoperability” award for its UCIe 3.0 specification. The latest version of the Universal Chiplet Interconnect Express standard increases performance and aims to strengthen multi-vendor interoperability for high-speed die-to-die links.
Sarcina Technology earned recognition in the “Packaging: Hardware” category for its chiplet-based AI package design. The company offers turnkey packaging and test services designed to deliver scalable, high-bandwidth systems without requiring customers to build internal advanced packaging capabilities.
- Awards presented at the fourth annual Chiplet Summit in Santa Clara
- Categories: Packaging: Design; Connectivity and Interoperability; Packaging: Hardware
- Focus areas: 2.5D/3D integration, die-to-die interconnect, AI-oriented chiplet packaging
- Event organized by Semper Technologies, producer of Chiplet Summit
“Chiplet innovation is everywhere,” said Chuck Sobey, General Chair, Chiplet Summit. “We received a wide range of compelling submissions that highlighted advances in design, interoperability, and packaging. We congratulate our winners on their leadership and technical excellence.”
