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Intel Foundry presented a 300 mm gallium nitride (GaN)-on-silicon chiplet platform at the IEEE International Electron Devices Meeting (IEDM) 2025, highlighting an ultra-thin GaN chiplet with…
The UALink Consortium released a new set of specifications that expand its open scale-up interconnect framework for AI infrastructure, adding support for in-network compute, chiplet integration,…
Baya Systems and Aion Silicon announced a partnership to deliver an integrated solution aimed at accelerating complex SoC and chiplet-based semiconductor designs. The companies…
Santa Clara, Calif. — Feb. 18, 2026 — At today’s Chiplet Summit 2026, Debendra Das Sharma, **Chair of the UCIe Consortium, laid out how Universal Chiplet Interconnect Express…
Santa Clara, Calif. — Feb. 18, 2026 – At today’s Chiplet Summit 2026, AlphawaveSemi — now part of Qualcomm — underscored that connectivity has…
Santa Clara, Calif. — Feb. 18, 2026 — As AI models scale toward trillion-parameter regimes and agentic AI workloads proliferate, the semiconductor industry is…
The Chiplet Summit recognized three companies for technical innovation at its 2026 Best of Show Awards, held at the Santa Clara Convention Center. Organizers…
NewPhotonics announced a 1.6T near-packaged optics (NPO) chiplet designed to bring serviceability and interoperability into next-generation AI data center architectures. The new NPC50503 integrates lasers…
Cadence unveiled a new Chiplet Spec-to-Packaged Parts ecosystem aimed at reducing engineering complexity and accelerating time to market for customers building chiplets for physical AI,…
Intel Foundry moved to accelerate industry momentum around modular semiconductor design this week by advancing its strategy for an open chiplet marketplace. The company…
Lessengers unveiled an immersion-cooled, detachable 800G Near-Packaged Optics (NPO) module directly integrated with Alphawave Semi’s AlphaCHIP1600-IO chiplet at SC25 in St. Louis. The live…
PowerLattice emerged from stealth with a $25 million Series A round to commercialize a power-delivery chiplet designed to cut compute power needs by more…
Tenstorrent introduced the Open Chiplet Atlas (OCA) Ecosystem, an open framework designed to standardize and accelerate development across the emerging chiplet market. Unveiled at…