As part of the Chips for America program to drive U.S. leadership in semiconductors, $3 billion will be allocated to a new National Advanced Packaging Manufacturing Program. The funding targets advanced packaging technology in the United States that can be deployed to manufacturing facilities, including recipients of CHIPS manufacturing incentives.
An initial funding opportunity for this program is expected to be announced in early 2024.
The approximately $3 billion program will be dedicated to activities that include an advanced packaging piloting facility for validating and transitioning new technologies to U.S. manufacturers; workforce training programs to ensure that new processes and tools are capably staffed; and funding for projects that focus on:
materials and substrates,
equipment, tools and processes,
power delivery and thermal management,
photonics and connectors,
a chiplet ecosystem, and
co-design for test, repair, security, interoperability and reliability.
“Within a decade, we envision that America will both manufacture and package the world’s most sophisticated chips,” said NIST Director Laurie E. Locascio. “This means both onshoring a high-volume advanced packaging industry that is self-sustaining, profitable and environmentally sound, and conducting the research to accelerate new packaging approaches to market.”
The four R&D programs under the CHIPS for America initiative are:
National Semiconductor Technology Center: This public-private consortium is aimed at being the central point for semiconductor research across the nation.
National Advanced Packaging Manufacturing Program: Focused on developing the capability to package chips in multiple dimensions with various functions, known as advanced packaging, to maintain leadership in semiconductor manufacturing.
Manufacturing USA Institute(s) : Funded by CHIPS for America, these institutes will advance research and commercialization of semiconductor manufacturing technologies, with a focus on virtualization, simulation, automation, and workforce training.
CHIPS R&D Metrology : Managed by NIST, this program involves the measurement science critical for developing new materials, packaging, and production methods for semiconductors. It includes working on reference materials, data, and calibrations for chip manufacturing equipment and advising on standards development for processes and cybersecurity