Micron Technology selected Bechtel as its engineering, procurement and construction (EPC) partner for the first phase of the company’s leading-edge memory manufacturing complex in Clay, New York. The move advances construction of what Micron plans to develop into the largest semiconductor manufacturing facility in the United States and a key pillar of domestic memory production for AI-era computing infrastructure.
Bechtel will immediately mobilize at the White Pine Commerce Park site in Onondaga County as Micron transitions from site preparation into the next phase of fab construction. Micron broke ground on its first New York fab in January 2026. The broader project represents the largest private investment in New York state history and is expected to generate approximately 50,000 jobs, including more than 4,500 construction positions. Micron estimates the project will contribute approximately $16.7 billion annually in economic output and $5.4 billion annually in personal income across New York over the next three decades.
The facility will manufacture leading-edge memory products used in AI systems, cloud infrastructure, high-performance computing and other data-intensive applications. Bechtel will deploy an integrated EPC model encompassing engineering, procurement, digital construction technologies, modularization strategies and project controls. The project includes the complex cleanroom environments, ultra-high-purity process systems, advanced electrical infrastructure and vibration-controlled foundations required for advanced semiconductor manufacturing.
• Bechtel will serve as EPC partner for the first phase of Micron’s New York memory manufacturing campus.
• Construction follows Micron’s January 2026 groundbreaking in Clay, New York.
• The project is expected to create approximately 50,000 jobs, including more than 4,500 construction jobs.
• Micron projects $16.7 billion in annual economic output and $5.4 billion in annual personal income impact for New York.
• The campus is planned to become the largest semiconductor manufacturing facility in the United States.
• The facility will manufacture advanced memory products supporting AI, cloud and high-performance computing markets.
“Our New York project will be home to the most advanced memory manufacturing in the world and will serve as a cornerstone of America’s leadership in the AI era,” said Manish Bhatia, executive vice president of Global Operations at Micron Technology. “We are entering an exciting new phase of construction.”
🌐 Analysis: Micron’s New York project arrives as global demand for high-bandwidth memory (HBM) and advanced DRAM continues to accelerate alongside AI infrastructure deployments. The company has become one of the primary suppliers of HBM used in NVIDIA AI platforms and has been expanding manufacturing capacity in both the United States and Asia to support projected demand through the remainder of the decade. The Clay project complements Micron’s ongoing Idaho fab development and broader U.S. manufacturing strategy supported by federal and state incentives.
