OIF announced its Co-Packaging-3.2T-Module-01.0 Implementation Agreement for Ethernet switching applications utilizing 100G electrical lanes while ensuring backward compatibility with 50G lanes.
The module definition can be in the form of an optical module or a passive copper cable assembly and provides ~140G/mm of bandwidth edge-density. It can enable optical and/or electrical interfaces for a 51.2Tb/s aggregate bandwidth switch.
The new IA includes interoperability specifications for the 3.2 Tb/s CPO modules, including:
- 8x400Gb/s optical interface options for FR4 and DR4 connectivity
- 32 x CEI-112G-XSR host interface (or 32 x CEI-56G-XSR in “backwards compatible” mode)
- Opto-mechanical module specifications
- Electrical specifications
- Control and management interface, enabled by enhancements to the existing OIF CMIS specification
“OIF’s members are committed to driving innovation and progress in co-packaging, continuously seeking ways to improve and innovate,” said Jeff Hutchins, OIF PLL Working Group Co-Packaging Vice Chair and Board Member, Ranovus. “This IA is part of a trio of projects which include the Framework project and the External Laser Small Form Factor Pluggable (ELSFP) project. Building on OIF’s successful track record of coherent and laser module IAs, it addresses the market need for interoperable integrated optics standardization identified by the CPO Framework IA.”
“Considerable progress has been made in co-packaging, and this new IA, along with a collaborative ecosystem, is a critical piece to propel the technology so that it meets industry needs, including that of Cloud service providers as they build their next-generation AI networks,” said Richard Ward, Technical Editor of the OIF 3.2T Co-Packaged Module IA, Astera Labs.