OIF announced an implementation agreement for external lasers delivering continuous wave (CW) light to optical transceivers co-packaged within a system.
The External Laser Small Form-Factor Pluggable (ELSFP) Implementation Agreement (IA) specifies a front panel pluggable form factor tailored to co-packaged optical systems and other multiple laser external laser source applications.
OIF says this is the first multi-sourced, front panel pluggable external laser source form factor to address the evolving needs of the industry. By placing the laser sources at the front panel, which is the coolest section of the system, the design improves system reliability and allows for efficient “hot-swap” field replacement when necessary.
The ELSFP uses a multi-fiber blind-mate optical connector positioned at the rear of the module. This strategic design mitigates potential eye-safety risks, particularly in applications where high optical powers are involved. Each ELSFP can supply optical power to one or more optical engines, all seamlessly managed by OIF’s Common Management Interface Specification (CMIS).
This IA also defines interoperability for mechanical, thermal, electrical and optical parameters as well as establishing standard power ranges and fiber configurations to focus the industry’s development.
The final feature unique to ELSFP is the pass-through option which allows systems architects to maximize face plate real estate, solidifying ELSFP’s position as a versatile and adaptable solution for various optical networking applications.
“The ELSFP IA represents a significant milestone for the optical networking industry,” said Jeff Hutchins, OIF Board Member and Physical & Link Layer (PLL) Working Group Co-Packaging Vice Chair and Ranovus. “By providing a front panel pluggable external laser source form factor, we’re empowering network operators and equipment manufacturers with a cutting-edge solution that not only improves reliability but also paves the way for future innovations. The ELSFP’s flexible design accommodates the ever-changing needs of the industry, enabling seamless integration with OIF’s 3.2T co-packaged optical module project and beyond.”
OIF also notes that while the ELSFP project was originally envisioned to complement the 3.2T co-packaged optical module, its forward-looking design makes it easily extensible to address future requirements.
“The ELSFP has already garnered a favorable industry reception through its potential to propel external laser source applications forward, as evidenced by strong collaboration among OIF member both in writing the IA and the substantial engagement in numerous interoperability demonstrations facilitated by OIF,” said Jock Bovington, Cisco, and editor of the OIF ELSFP IA.