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Home » Overture Adds adds Copper Density to Ethernet over Optical and TDM

Overture Adds adds Copper Density to Ethernet over Optical and TDM

April 1, 2014
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Overture rolled out a number of enhancements to its 6500 service aggregation and switching platform, including a 96-pair Ethernet over Copper (EoC) interface module that makes the 6500 the industry’s highest density EoC solution on the market.

The EoC interface module offers from 1 to 24 pair bonding across cards for resilient delivery of up to 300Mbps of symmetric performance-assured Ethernet service. The 6500 integrates seamlessly with Overture’s 400, 4000, and 6100 family of EoC Ethernet Access Devices to enable rapid service deployment on any scale.

“The 6500 and Ensemble OSA represent a fundamental new approach for service creation, activation and assurance,” said Keith Donahue, vice president of Product Management, Overture. “Ubiquitous Carrier Ethernet access – as enabled by the 6500 – is the foundation on which virtualization and software-defined services will be used to drive service agility and improve operational efficiency. At Overture, we are committed to helping service providers meet today’s challenges while providing a path to efficiently address future service evolution.”

http://www.overturenetworks.com

Tags: Blueprint columnsEthernet-over-CopperOvertureSwitching
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