• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Monday, May 25, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Broadcom’s 802.11ac Chip Offers Sub-Meter Indoor Location

Broadcom’s 802.11ac Chip Offers Sub-Meter Indoor Location

April 1, 2014
in All
A A

Broadcom introduced an 802.11ac system-on-chip (SoC) featuring indoor positioning technology.

The BCM43462 SoC uses Broadcom’s new AccuLocate technology to provide sub-meter accuracy on physical locations enabling retailers and public venue operators to deliver more personalized experiences to consumers.  It leverages fine timing measurement (FTM) technology, which Broadcom says yields highly accurate positioning regardless of environmental factors. Previous versions of indoor positioning relied on received signal strength indicator (RSSI) technology, where signal strength and performance can vary depending on environmental factors such as crowd density or temperature.

Key Features of the Broadcom BCM43462 SoC

  • Dual-band (2.4 GHz and 5 GHz) complete 5G WiFi (11ac) SoC with integrated MAC, PHY and radio
  • Three-stream spatial multiplexing up to 1.3 Gbps
  • State-of-the-art security provided by industry standardized system support
  • Embedded hardware acceleration enables increased system performance
  • Full IEEE 802.11a/b/g/n legacy compatibility with enhanced performance
  • Support for FASTPATH UAP, Broadcom’s enterprise class access point software

http://www.broadcom.com

Tags: 802.11acBlueprint columnsBroadcomSilicon
ShareTweetShareSummarizeSummarize
Previous Post

Equinix Opens Fifth Data Center in Dallas

Next Post

Overture Adds adds Copper Density to Ethernet over Optical and TDM

Staff

Staff

Related Posts

Semiconductors

Broadcom Joins Applied Materials EPIC to Accelerate Chip Packaging

May 21, 2026
Semiconductors

Broadcom Pushes Wi-Fi 8 into Volume Markets with Integrated 10G PON Silicon

May 1, 2026
Clouds and Carriers

Broadcom and Google Cloud Expand Observability

April 22, 2026
Semiconductors

Broadcom Lands Major Meta AI Silicon Win With Multi-Generation MTIA Deal

April 14, 2026
Video

#Video: AI Threats Are Real: How Defenders Win

April 10, 2026
Security

Broadcom Targets Payment Fraud and False Declines

April 8, 2026
Next Post

Overture Adds adds Copper Density to Ethernet over Optical and TDM

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2026 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version