FS has introduced an 800G Linear Pluggable Optics (LPO) module optimized for AI and HPC data center interconnects, targeting efficiency ...

izmomicro, a division of izmo Ltd., announced a milestone in silicon photonics packaging, becoming the first company in India to ...

Xscape Photonics and Tower Semiconductor introduced an on-chip, optically pumped, multi-wavelength laser platform designed for AI datacenter fabrics. The prototype, ...

Lambda, which brands itself as the “Superintelligence Cloud,” has integrated Supermicro’s GPU-optimized servers to accelerate training and inference workloads for ...

Intel secured a landmark deal with the Trump Administration, which will see the U.S. government invest $8.9 billion in Intel ...

AI clusters are hitting a wall with copper cabling, and Avicena CEO Bardia Pezeshki believes microLEDs are the way through. ...

At the IEEE Hot Interconnects online conference, Alan Benjamin, CEO of GigaIO, delivered an online presentation highlighting the company’s SuperNODE ...

Aligned Data Centers has secured more than $1 billion in financing commitments from Blackstone Credit & Insurance (BXCI) to accelerate ...

At the IEEE Hot Interconnects 2025, Intel’s Debendra Das Sharma outlined how the Universal Chiplet Interconnect Express (UCIe) can extend ...

Preliminary findings reveal that market conditions for radio access network (RAN) equipment continued to stabilize in the quarter, according to ...

Microsoft is building out AI-scale networking with more than $100 billion in near-term investment, said Deepak Bansal, Corporate VP, during ...

At this week’s IEEE Hot Interconnects conference, Meta outlined the extraordinary scale and technical challenges of building one of the ...

Arista Networks co-founder Andreas Bechtolsheim used his keynote at IEEE Hot Interconnects 2025 to highlight how Linear Pluggable Optics (LPO) ...